2017
DOI: 10.1007/s10544-017-0189-9
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Accelerated life-test methods and results for implantable electronic devices with adhesive encapsulation

Abstract: We have developed and applied new methods to estimate the functional life of miniature, implantable, wireless electronic devices that rely on non-hermetic, adhesive encapsulants such as epoxy. A comb pattern board with a high density of interdigitated electrodes (IDE) could be used to detect incipient failure from water vapor condensation. Inductive coupling of an RF magnetic field was used to provide DC bias and to detect deterioration of an encapsulated comb pattern. Diodes in the implant converted part of t… Show more

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Cited by 18 publications
(13 citation statements)
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“…There are many factors which causes failure of an electronic device such as thermal effect, environmental effect, mechanical or electrical overloading etc. The failure can be done at packing level due to solder joints [5]. The electronic components have a vital role in army related vehicles.…”
Section: Reliability and Failure Predictionmentioning
confidence: 99%
“…There are many factors which causes failure of an electronic device such as thermal effect, environmental effect, mechanical or electrical overloading etc. The failure can be done at packing level due to solder joints [5]. The electronic components have a vital role in army related vehicles.…”
Section: Reliability and Failure Predictionmentioning
confidence: 99%
“…Huang et al [19] tested IDCs connected to an ingenious inductively-coupled circuit. These dummy implants used ceramic substrates and gold tracks; these were cleaned in various ways and encapsulated in epoxy.…”
Section: Using the Apparatus In Implant Life-testing Researchmentioning
confidence: 99%
“…For all these scenarios, the presence of liquid water is necessary. Yet, for the latter case, the presence of an electric field between the metals is the main driving force [2][3][4].…”
Section: Introductionmentioning
confidence: 99%