Accelerated curing of adhesively bonded G-FRP tube connections — Part I: Experiments

Voß, Morten; Haupt, Jona

doi:10.1016/j.compstruct.2021.113999

Cited by 10 publications

(3 citation statements)

References 57 publications

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“…Voß and co-workers [46][47][48] thoroughly investigated the kinetics and the mechanical behavior (in particular, the load capacity) of fiber-reinforced adhesively-bonded composite tubular joints in the presence of Mn-Zn-ferrite particles (the so-called Curie particles, used as susceptors), which were incorporated at 33.3 wt.% loading into two adhesives (namely, a two-component epoxy and a polyurethane system). The presence of the susceptors accounted for an increase in the curing kinetics of the adhesives.…”

Section: Curing Of Thermosetting Systemsmentioning

confidence: 99%

Insights into Induction Heating Processes for Polymeric Materials: An Overview of the Mechanisms and Current Applications

Mariani

Malucelli

2023

Energies

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In polymer systems, induction heating (IH) is the physical outcome that results from the exposure of selected polymer composites embedding electrically-conductive and/or ferromagnetic fillers to an alternating electromagnetic field (frequency range: from kHz to MHz). The interaction of the applied electromagnetic field with the material accounts for the creation of magnetic polarization effects (i.e., magnetic hysteresis losses) and/or eddy currents (i.e., Joule losses, upon the formation of closed electrical loops), which, in turn, cause the heating up of the material itself. The heat involved can be exploited for different uses, ranging from the curing of thermosetting systems, the welding of thermoplastics, and the processing of temperature-sensitive materials (through selective IH) up to the activation of special effects in polymer systems (such as self-healing and shape-memory effects). This review aims at summarizing the current state-of-the-art of IH processes for polymers, providing readers with the current limitations and challenges, and further discussing some possible developments for the following years.

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Section: Curing Of Thermosetting Systemsmentioning

confidence: 99%

Insights into Induction Heating Processes for Polymeric Materials: An Overview of the Mechanisms and Current Applications

Mariani

Malucelli

2023

Energies

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“…There are studies on the effect of curing temperature and curing times on the adhesion performance of structural and non-structural adhesives [10][11][12][13][14][15][16][17].…”

Section: Introductionmentioning

confidence: 99%

Experimental Investigation of the Effect of Curing Pressure on Strength of Single Lap Adhesive Joints

SARAÇ

2023

EJT

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It is a common method to apply a certain pressure to the bonded surfaces while bonding. In this way, it is ensured that the adhesive covers all surfaces and the air in the adhesive is evacuated. However, the effects of pressure changes on the curing process and mechanical properties, especially in adhesives that harden by chemical reaction, are an issue that should be handled with numerical data at a scientific level. When the literature is examined, there are limited studies on the effects of curing pressure on mechanical properties of adhesive joints. In this study, the effect of curing pressure on bond strength in adhesive joints was investigated experimentally. Single lap adhesive joints were manufactured using steel plate and DP460 epoxy. At this stage, bonding joints with different curing pressure conditions were obtained by placing weights on the adhesive area. The samples were subjected to tensile tests. In consequence of the experiments, a reducing in the joint endurance was observed after a certain pressure value. Thus, it has been understood that the pressure applied to the adhesive area affects the curing process, and must be taken within certain limits.

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“…Therefore, it is very important to reduce the curing temperature of epoxy/aromatic amine adhesive systems and improve the toughness of the epoxy structural adhesives without reducing the heat-resistance. 27 A reduction in curing temperature can reduce the energy consumption and cost of manufacturing adhesively bonded structural parts, 28,29 especially when the structural parts are large. 30 Seraji et al 31 utilized 2-ethyl-4-methylimidazole (2E4MI) and boron trifluoride ethylamine (BF 3 ) to accelerate the curing of flame-retardant-modified epoxy amine resin systems.…”

Section: Introductionmentioning

confidence: 99%

Accelerated‐curing epoxy structural film adhesive for bonding lightweight honeycomb sandwich structures

Zhao

Qiao

et al. 2022

J of Applied Polymer Sci

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Accelerating the curing of epoxy/aromatic amine adhesives and improving their toughness are challenges in heat-resistant epoxy structural adhesives. Herein, we report an epoxy/aromatic amine adhesive accelerated curing system with an oxo-centered trinuclear (chromium III) complex, which is toughened using a thermoplastic block copolymer (TPBC). The reaction characteristics, heat resistance, microstructure, and bonding properties of the accelerated epoxy adhesives were analyzed. The reaction peak temperature of the epoxy with 3% catalyst was 113.1 C, which was 113.6 C lower than that of epoxy without catalyst, and the modified epoxy resin demonstrated a potential for rapid curing at medium temperature. The glass transition temperature of the TPBC-toughened epoxy adhesive was 125 C after curing, indicating excellent thermal stability after medium temperature curing. The introduction of the TPBC increased the single-lap shear strength of the epoxy adhesive without reducing its heat resistance. The shear strength at room temperature and 120 C of the modified epoxy adhesive with 50 phr of TPBC was 25.2 and 10.9 MPa, respectively. Moreover, the epoxy film adhesive exhibited outstanding bonding properties when used in the bonding of lightweight honeycomb sandwich structures.

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Accelerated curing of adhesively bonded G-FRP tube connections — Part I: Experiments

Cited by 10 publications

References 57 publications

Insights into Induction Heating Processes for Polymeric Materials: An Overview of the Mechanisms and Current Applications

Insights into Induction Heating Processes for Polymeric Materials: An Overview of the Mechanisms and Current Applications

Experimental Investigation of the Effect of Curing Pressure on Strength of Single Lap Adhesive Joints

Accelerated‐curing epoxy structural film adhesive for bonding lightweight honeycomb sandwich structures

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