Abrasive Particles Trajectory Analysis and Simulation of Cluster Magnetorheological Effect Plane Polishing

Pan, Jisheng; Yan, Qiusheng; Xu, Xipeng; Zhu, Jiangting; Wu, Z; Bai, Zhenwei

doi:10.1016/j.phpro.2012.03.067

Cited by 28 publications

(9 citation statements)

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“…The simulation was carried out using Matlab 2015 software [3]. The main variables involved in the polishing process and which are part of the kinematic study are: the trajectory of the abrasive particle, the speed of the particle and its acceleration [2]. Figure 1 shows the path that the polishing machine takes for the 4 basic movements selected in this study.…”

Section: Methodsmentioning

confidence: 99%

Kinematic analysis of an abrasive particle during the polishing process of floors

García¹,

Cobos²,

Yepes³

2018

ces

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Section: Methodsmentioning

confidence: 99%

Kinematic analysis of an abrasive particle during the polishing process of floors

García¹,

Cobos²,

Yepes³

2018

ces

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“…Pan et al [11] used MRF to process single-crystal 6H-SiC, achieving an R a value of 1.9 nm. Yin et al [12] applied electromagnetic field-excited high-polishing mode magnetorheological polishing of single-crystal SiC and obtained a smooth wafer surface with an R a value of 0.6 nm.…”

Section: Introductionmentioning

confidence: 99%

Experimental Study on Shear Rheological Polishing of Si Surface of 4H-SiC Wafer

et al. 2023

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In this study, shear rheological polishing was used to polish the Si surface of six-inch 4H-SiC wafers to improve polishing efficiency. The surface roughness of the Si surface was the main evaluation index, and the material removal rate was the secondary evaluation index. An experiment was designed using the Taguchi method to analyze the effects of four critical parameters (abrasive particle size, abrasive particle concentration, polishing speed, and polishing pressure) on the Si surface polishing of SiC wafers. By evaluating the experimental results for the signal-to-noise ratio, the weight of each factor was calculated using the analysis of variance method. The optimal combination of the process parameters was obtained. Below are the weightings for the influence of each process on the polishing result. A higher value for the percentage means that the process has a greater influence on the polishing result. The wear particle size (85.98%) had the most significant influence on the surface roughness, followed by the polishing pressure (9.45%) and abrasive concentration (3.25%). The polishing speed had the least significant effect on the surface roughness (1.32%). Polishing was conducted under optimized process conditions of a 1.5 μm abrasive particle size, 3% abrasive particle concentration, 80 r/min polishing speed, and 20 kg polishing pressure. After polishing for 60 min, the surface roughness, Ra, decreased from 114.8 to 0.9 nm, with a change rate of 99.2%. After further polishing for 60 min, an ultrasmooth surface with an Ra of 0.5 nm and MRR of 20.83 nm/min was obtained. Machining the Si surface of 4H-SiC wafers under optimal polishing conditions can effectively remove scratches on the Si surface of 4H-SiC wafers and improve the surface quality.

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“…To obtain a flat-machined surface using ERP or MRP, the device structure and polishing process require optimization. In addition, when polishing a work-piece with multiple magnets, non-magnetic abrasives tend to be enriched in areas between the magnets with weak or no magnetic field intensity [11,12]. It causes wastage of abrasives and increases the cost of polish.…”

Section: Introductionmentioning

confidence: 99%

Study on the rheological and polishing properties of electromagnetic two-phase composite particles with abrasive characteristics

CHEN¹,

Pan²,

Yan³

et al. 2022

Smart Mater. Struct.

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Electromagnetic composite rheological polishing (EMRP) is a new ultra-precision machining technology that combines electro-rheological polishing (ERP) and magneto-rheological polishing (MRP). The key technology of the polishing method is the preparation of electromagnetic composite rheological fluid (EMRF) with both electro- and magneto-rheological properties, especially the preparation of composite particles with electro- and magneto-rheological effects. In this study, the EMRF was prepared by using electromagnetic two-phase particles with abrasive characteristics. The electromagnetic two-phase composite particles are synthesized in two steps: the coupling method and sol-gel method. The two-step method successfully prepared the electromagnetic two-phase composite particles with nano-diamond particles embedded randomly on the surface. The electro-rheological shear stress of EMRF can reach 160.7 Pa when the test parameter voltage is 2.5 kV, and magneto-rheological shear stress of EMRF can reach 4076 Pa when the electromagnet excitation current is 3 A. When a fused silica glass is polished under a single magnetic field, the material removal depth reaches a maximum of 2.7 μm at a radius of 13.5 mm. Under the action of the electromagnetic compound field, the removal profile of the work-piece is smoother, and the material removal depth reaches the maximum value of 2.1 μm at a radius of 10.5 mm. This proves that the stiffness distribution of the polishing pad under the electromagnetic composite field is more dispersed than that under a single field. Therefore, the distribution of electromagnetic two-phase composite particles can be controlled by applying an electromagnetic composite field, which provides a good foundation for the abrasive control technology of EMRP.

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Abrasive Particles Trajectory Analysis and Simulation of Cluster Magnetorheological Effect Plane Polishing

Cited by 28 publications

References 0 publications

Kinematic analysis of an abrasive particle during the polishing process of floors

Kinematic analysis of an abrasive particle during the polishing process of floors

Experimental Study on Shear Rheological Polishing of Si Surface of 4H-SiC Wafer

Study on the rheological and polishing properties of electromagnetic two-phase composite particles with abrasive characteristics

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