Abnormally high strength and low electrical resistivity of the deformed Cu/Mg-composite with a big number of Mg-filaments

Volkov, A. Yu.; Антонов, Б. Д.; Патраков, Е. И.; Волкова, Е. Г.; Komkova, D. A.; Kalonov, A. A.; Glukhov, A. V.

doi:10.1016/j.matdes.2019.108276

Cited by 14 publications

(12 citation statements)

References 25 publications

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“…This way, during the bundling, optimum number of wires are joined and locked together from all six sides. Figure 2(a), (c), (e), (g) shows the preparation of monofilament components for Cu-Mg, 53 C, 56 Nb, 40 and Al 54 composite wires.…”

Section: Processing Methodsmentioning

confidence: 99%

“…9 Such treatments enhance mechanical stability due to better bonding among the components during accumulative drawing and reduce chances of electron scattering in completely deformed wires. 53,61…”

Section: Processing Methodsmentioning

confidence: 99%

“…Monofilament wire preparation (step-0). This step involves the preparation of monofilament wires in combinations such as powder or rods 19,[52][53][54] of reinforcing metal in matrix tube, mixture of powders 11,55,56 compacted in a holder can or already solidified cast ingots. 57,58 The PD for step-0 is preferred to be rolling with die angles selected in such a way that the cross-section acquires a hexagonal shape.…”

Section: Bundle-and-deform Processing Techniquementioning

confidence: 99%

“…For example, a temperature of 200 °C was selected for Cu-Mg to avoid formation of CuMg 2 and Cu 2 Mg phases. 53 Likewise, the extrusion temperature of Al-Ti was selected carefully to avoid formation of Al 3 Ti phase. 9 Such treatments enhance mechanical stability due to better bonding among the components during accumulative drawing and reduce chances of electron scattering in completely deformed wires.…”

Section: Bundle-and-deform Processing Techniquementioning

confidence: 99%

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Deformation processed high strength high conductivity Cu and Al matrix composite wires: An introductory review

Zafar

Nair

2022

Proceedings of the Institution of Mechanical Engineers, Part L:

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Deformation processed wires are used in the fields which demand the combination of contradictory properties such as mechanical strength and electrical conductivity. For the last 4–5 decades, scientists have focused on fabricating Cu and Al matrix wires using various plastic deformation techniques. While the high electrical conductivity is ensured through mentioned elements, the strength is achieved by orderly employment of plastic deformation and various heat treatments for basically achieving microscale filamentary structure of reinforcing elements. However, the strict selection criteria of starting materials and contradicting nature of processing regime and expected properties require proper knowledge of materials-microstructure and fabrication-property correlations. This paper summarizes the manufacturing methods, processing parameters-microstructure interactions, consequential mechanical and electrical properties and finally, current, and potential applications of deformation processed bi-metallic composite wires. It will help engineers, through provided comparative analysis, choose appropriate processing routes and starting materials for the realization of high strength/conductivity wires as well as guide what to expect in terms of targeted properties.

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Section: Processing Methodsmentioning

confidence: 99%

Section: Processing Methodsmentioning

confidence: 99%

Section: Bundle-and-deform Processing Techniquementioning

confidence: 99%

Section: Bundle-and-deform Processing Techniquementioning

confidence: 99%

See 2 more Smart Citations

Deformation processed high strength high conductivity Cu and Al matrix composite wires: An introductory review

Zafar

Nair

2022

Proceedings of the Institution of Mechanical Engineers, Part L:

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“…This provides implications helping to understand the positive/negative deviations the stress-strain curves of composite wires show from the RoM prediction. There are several studies in the literature on the applicability of the RoM for approximating the mechanical behavior of bimetallic composites [11][12][13]. Therefore, a primarily numerical approach was adopted to simulate the wire drawing of Cu-Al and Fe-Al wires of the same Al volume fraction (50%) and diameter (3 mm).…”

Section: Introductionmentioning

confidence: 99%

Metal Forming-Induced Residual Stresses and Rule of Mixtures’ Prediction of Tensile Behavior of Bimetallic Wires

Dashti

Guillet

Keller

et al. 2022

KEM

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The present study investigates the tensile behavior of the two bimetallic composite wires Cu-Al and Fe-Al. The purpose is to understand the deviation their tensile strengths show from the Rule of Mixtures’ prediction. To that end, an experimental-numerical approach was adopted. Following tensile testing of the above cold-drawn composite wires, the manufacturing process (wire drawing) was simulated via finite element analysis. The prominent role of processing-induced residual stresses on the yield strength of cold-drawn products is known. Therefore, a discussion based on the axial tensile residual stress profile was developed. It was concluded that the higher-magnitude-near-surface tensile residual stresses in the Fe-Al wire causes its tensile curve to show a negative deviation from the Rule of Mixtures (RoM). The Cu-Al wire, on the contrary, exhibits a slight positive deviation.

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Quantitative Analysis of Codeformation Behavior of Ceramic and Metallic Particle System

Zafar,

Nair

2023

J. of Materi Eng and Perform

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Abnormally high strength and low electrical resistivity of the deformed Cu/Mg-composite with a big number of Mg-filaments

Cited by 14 publications

References 25 publications

Deformation processed high strength high conductivity Cu and Al matrix composite wires: An introductory review

Deformation processed high strength high conductivity Cu and Al matrix composite wires: An introductory review

Metal Forming-Induced Residual Stresses and Rule of Mixtures’ Prediction of Tensile Behavior of Bimetallic Wires

Quantitative Analysis of Codeformation Behavior of Ceramic and Metallic Particle System

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