Abnormally high residual dislocation density in pure aluminum after Al/Ti/Al laminate annealing for seven days

Yu, Hailiang; Lü, Cheng; Kong, Charlie

doi:10.1080/09500839.2014.971902

Cited by 13 publications

(4 citation statements)

References 28 publications

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“…It is well known that the dislocations in crystalline solids are thermodynamically unstable entities 36 . Low temperatures can lead to a higher dislocation density that can effectively suppress dynamic recovery.…”

Section: Resultsmentioning

confidence: 99%

A new insight into ductile fracture of ultrafine-grained Al-Mg alloys

Tieu

Lü

et al. 2015

Sci Rep

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It is well known that when coarse-grained metals undergo severe plastic deformation to be transformed into nano-grained metals, their ductility is reduced. However, there are no ductile fracture criteria developed based on grain refinement. In this paper, we propose a new relationship between ductile fracture and grain refinement during deformation, considering factors besides void nucleation and growth. Ultrafine-grained Al-Mg alloy sheets were fabricated using different rolling techniques at room and cryogenic temperatures. It is proposed for the first time that features of the microstructure near the fracture surface can be used to explain the ductile fracture post necking directly. We found that as grains are refined to a nano size which approaches the theoretical minimum achievable value, the material becomes brittle at the shear band zone. This may explain the tendency for ductile fracture in metals under plastic deformation.

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Section: Resultsmentioning

confidence: 99%

A new insight into ductile fracture of ultrafine-grained Al-Mg alloys

Tieu

Lü

et al. 2015

Sci Rep

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“…This can be attributed to the absence of oxide films due to its inert nature, which permits dislocations to escape without pile-up at grain boundaries. Though aluminum had lower ultimate tensile strength, it encounters higher dislocation pile-up at the grain boundaries [49,50], thereby increasing resistance to deformation and, thus, resulting in higher von Mises. Thus, in the case of gold, high-strain rate deformation results in continuous breakdown and reformation of sub-grains as dislocations are translated through the material, resulting in a comparatively lower von Mises stress.…”

Section: Influence Of Dislocation Phenomenon On the Deformationmentioning

confidence: 99%

Deformation Mechanism of Aluminum, Copper, and Gold in Nanoimprint Lithography Using Molecular Dynamics Simulation

Gaikwad,

Olowe,

Desai

2023

Nanomaterials

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Material deformation during nanoimprinting of aluminum (Al), copper (Cu), and gold (Au) was explored through molecular dynamics simulations. A comparative understanding of the deformation behavior of three substrate materials important for design and high-resolution pattern transfer was highlighted. In this study, we analyzed three metrics, including von Mises stresses, lattice deformation, and spring-back for the chosen materials. Of the three materials, the highest average von Mises stress of 7.80 MPa was recorded for copper, while the lowest value of 4.68 MPa was computed for the gold substrate. Relatively higher von Mises stress was observed for all three materials during the mold penetration stages; however, there was a significant reduction during the mold relaxation and retrieval stages. The Polyhedral Template Matching (PTM) method was adopted for studying the lattice dislocation of the materials. Predominantly Body-Centered Cubic (BCC) structures were observed during the deformation process and the materials regained more than 50% of their original Face-Centered Cubic (FCC) structures after mold retrieval. Gold had the lowest vertical spring-back at 6.54%, whereas aluminum had the highest average spring-back at 24.5%. Of the three materials, aluminum had the lowest imprint quality due to its irregular imprint geometry and low indentation depth after the NIL process. The findings of this research lay a foundation for the design and manufacture of Nanoimprint Lithography (NIL) molds for different applications while ensuring that the replicated structures meet the desired specifications and quality standards.

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“…In rncnnt ynars, 'sandwice' laminatn sennts eavn attractnd a grnat dnal of attnntion dun to tenir nxcnllnnt propnrtins [1][2][3][4] weice makn tenm idnally suitnd for divnrsn functions suce as ballistic protnction, enat nxceangn, blast mitigation and vibration damping [5][6]. Roll-bonding tnceniquns eavn bnnn succnssfully applind to fabricatn multicomponnnt matnrials wite tailornd propnrtins by rninforcnmnnt or grading, suce as Al/Ti [7][8][9][10][11][12], hu/Ti [13,14], Al/Mg [15,16], Al/hu [17,18] and Al/Stnnl [19,20].…”

Section: Introductionmentioning

confidence: 99%

“…Tenrn arn somn rnports teat Al/Ti/Al laminatn sennts fabricatnd by room-tnmpnraturn roll bonding [7][8][9][10][11][12]. Yu nt al [7] fabricatnd a trimodal laminatn sennts combinnd wite coarsn-grainnd Al, ultrafinn-grainnd Ti and TiAl3 particlns combinnd room-tnmpnraturn roll bonding and annnaling.…”

Section: Introductionmentioning

confidence: 99%