2011
DOI: 10.3390/s111211112
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A Zinc Oxide Nanorod Ammonia Microsensor Integrated with a Readout Circuit on-a-Chip

Abstract: A zinc oxide nanorod ammonia microsensor integrated with a readout circuit on-a-chip fabricated using the commercial 0.35 μm complementary metal oxide semiconductor (CMOS) process was investigated. The structure of the ammonia sensor is composed of a sensitive film and polysilicon electrodes. The ammonia sensor requires a post-process to etch the sacrificial layer, and to coat the sensitive film on the polysilicon electrodes. The sensitive film that is prepared by a hydrothermal method is made of zinc oxide. T… Show more

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Cited by 22 publications
(15 citation statements)
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References 15 publications
(20 reference statements)
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“…The sensitive material of the sensor was polyaniline, and the sensor had a sensitivity of 0.88 mV/ppm. A comparison to Yang et al [15] and Liu et al [16], the sensitivity of the sensor in this work exceeds that of Yang et al [15] and Liu et al [16]. …”
Section: Resultscontrasting
confidence: 77%
See 1 more Smart Citation
“…The sensitive material of the sensor was polyaniline, and the sensor had a sensitivity of 0.88 mV/ppm. A comparison to Yang et al [15] and Liu et al [16], the sensitivity of the sensor in this work exceeds that of Yang et al [15] and Liu et al [16]. …”
Section: Resultscontrasting
confidence: 77%
“…An ammonia sensor integrated with a readout circuit, proposed by Yang et al [15], was manufactured by the commercial 0.35 µm CMOS process and a post-process. The sensitive material of the ammonia sensor was zinc oxide, and its sensitivity was 1.5 mV/ppm.…”
Section: Resultsmentioning
confidence: 99%
“…In this work, we employ complementary metal oxide semiconductor (CMOS)-MEMS technology to fabricate a micromachined RF switch with low actuation voltage of 12 V, and its pull-in voltage is lower than that of Wang et al [4], Angira et al [5], Gao et al [6], Giffney et al [7], Yang et al [8], Park et al [9] and Zheng et al [10]. The use of commercial CMOS process to fabricate MEMS devices is called CMOS-MEMS technology [11][12][13][14]. Micro sensors and actuators manufactured by this technology usually require a post-CMOS process to add functional materials [15][16][17] or to release suspended structures [18][19][20].…”
Section: Introductionmentioning
confidence: 99%
“…Fabrication of MEMS devices using the commercial CMOS process is called CMOS-MEMS technique [9,10], and microdevices manufactured by this technique usually need a post-process to release the suspended structures [11,12] or to add the functional films [13,14]. Because the COMS-MEMS technique is compatible with the commercial CMOS process, micro generators have a potential to combine with integrated circuits on-a-chip if they are produced by this technique.…”
Section: Introductionmentioning
confidence: 99%