2020 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS) 2020
DOI: 10.1109/bcicts48439.2020.9392982
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A Wideband and High Efficiency Ka-band GaN Doherty Power Amplifier for 5G Communications

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Cited by 18 publications
(16 citation statements)
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“…The performance of the DPA3W is summarized and compared to the State Of the Art (SOA) in Table V. The results prove to be competitive over a 1 GHz band, especially in terms of efficiency at deep back-off, although not outperforming twoway DPAs [26], [27] in terms of efficiency at saturation and at 6 dB OBO. Furthermore, the PAE is strongly affected by the complexity in terms of presence/absence of driver stages, and thus by the gain.…”
Section: A Continuous Wave (Cw) Measurementsmentioning
confidence: 99%
“…The performance of the DPA3W is summarized and compared to the State Of the Art (SOA) in Table V. The results prove to be competitive over a 1 GHz band, especially in terms of efficiency at deep back-off, although not outperforming twoway DPAs [26], [27] in terms of efficiency at saturation and at 6 dB OBO. Furthermore, the PAE is strongly affected by the complexity in terms of presence/absence of driver stages, and thus by the gain.…”
Section: A Continuous Wave (Cw) Measurementsmentioning
confidence: 99%
“…Figure 19 shows the chip photograph of the GaN Doherty MMIC PA, which was fabricated by the 0.15 μm gate length GaN process on the 50 μm thickness SiC substrate with the ISV structure [31]. Figure 20 shows the schematic of the impedance inverter formed by the Tee-network for the output combiner of the fabricated DPA.…”
Section: Gan Mmic Pa Technology Trend In 5g Mm-wave Systemmentioning
confidence: 99%
“…Fig 22. Measured ACPR, EVM, and PAE[31] Table4. State-of-the-art of a Ka-band Doherty GaN power amplifiers.…”
mentioning
confidence: 99%
“…ersion December 21, 2021 submitted to Electronics 4 of 17 processes (roughly 1 mm per device, i.e. 2 mm overall for a symmetric 6 dB DPA), the wide bandgap and consequently higher breakdown voltage of GaN, allows to achieve power densities 4 times higher than in GaAs (around 2 W/mm instead of 0.5 W/mm) permitting to reach with this technology output powers of up to 4 W from a single-chip DPA without any power combination [21][22][23]. Considering as a reasonable on-chip power combination one that doubles the active periphery, single-chip DPAs achieving up to 8 W can be expected.…”
Section: Power Levels and On-chip Combinationmentioning
confidence: 99%