Abstract:A wide-band microstrip-to-microstrip via transition used for connecting integrated circuits and antenna array in a multi-layered low-temperature co-fired ceramic substrate is investigated in this paper. The via transition is decomposed into external and internal segments to facilitate the design. The equivalent impedance of internal segment, consisting of multilayered through-hole via with four ground vias, is calculated from the lump-circuit model generated by Ansoft Q3D Extractor. The electrical performance … Show more
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