“…Every technology offers various gadgets a certain capability. Integrating parts allows for the creation of micro/nanosystems with numerous functionalities . Heterogeneous integration is the most frequently utilized technique, which enables bolometers to be directly connected to a bendable film or flexible cables to provide total system elasticity.…”
Section: Fabrication Approaches For Wearable Bolometersmentioning
confidence: 99%
“…Integrating parts allows for the creation of micro/nanosystems with numerous functionalities. 159 Heterogeneous integration is the most frequently utilized technique, which enables bolometers to be directly connected to a bendable film or flexible cables to provide total system elasticity. Several research scientists have examined the straightforward bottom-up coating of inorganic molecules on a polymer surface to fabricate flexible and elastic electronics.…”
Section: Fabrication Approaches For Wearable Bolometersmentioning
Incorporating nano-and microelectromechanical systems (NEMS/MEMS)-based sensors in clothing and developing more compact and flexible devices have gained popularity recently. NEMS/MEMS-based bolometers/sensors have gained significance due to their high sensitivity and accuracy in measuring physical parameters such as temperature, humidity, pressure, and infrared (IR) and ultraviolet (UV) radiations. When worn on the body, bolometers can be employed in various applications such as environmental monitoring or health tracking. This review highlights the progress of smart wearable bolometers as NEMS/ MEMS-based sensors in the healthcare industry. Instead of visiting multiple healthcare facilities or devices, now people can assess their health status by measuring body temperature, sensing motion, respiratory functioning, blood pressure, oxygen levels of the blood, and heart functioning by integrating these devices into fabriclike garments, socks, shoe insoles, wrist watches, and other pieces of clothing. The article concludes by describing their varied challenges and possible solutions and prospects.
“…Every technology offers various gadgets a certain capability. Integrating parts allows for the creation of micro/nanosystems with numerous functionalities . Heterogeneous integration is the most frequently utilized technique, which enables bolometers to be directly connected to a bendable film or flexible cables to provide total system elasticity.…”
Section: Fabrication Approaches For Wearable Bolometersmentioning
confidence: 99%
“…Integrating parts allows for the creation of micro/nanosystems with numerous functionalities. 159 Heterogeneous integration is the most frequently utilized technique, which enables bolometers to be directly connected to a bendable film or flexible cables to provide total system elasticity. Several research scientists have examined the straightforward bottom-up coating of inorganic molecules on a polymer surface to fabricate flexible and elastic electronics.…”
Section: Fabrication Approaches For Wearable Bolometersmentioning
Incorporating nano-and microelectromechanical systems (NEMS/MEMS)-based sensors in clothing and developing more compact and flexible devices have gained popularity recently. NEMS/MEMS-based bolometers/sensors have gained significance due to their high sensitivity and accuracy in measuring physical parameters such as temperature, humidity, pressure, and infrared (IR) and ultraviolet (UV) radiations. When worn on the body, bolometers can be employed in various applications such as environmental monitoring or health tracking. This review highlights the progress of smart wearable bolometers as NEMS/ MEMS-based sensors in the healthcare industry. Instead of visiting multiple healthcare facilities or devices, now people can assess their health status by measuring body temperature, sensing motion, respiratory functioning, blood pressure, oxygen levels of the blood, and heart functioning by integrating these devices into fabriclike garments, socks, shoe insoles, wrist watches, and other pieces of clothing. The article concludes by describing their varied challenges and possible solutions and prospects.
A pseudo-SoC technology incorporating heterogeneous devices has been developed by applying a wafer-level system integration technology. The pseudo-SoC is set up to realize one microchip with heterogeneous devices made by using individual processes for epoxy resin, insulating layer and redistribution layer, respectively. The individual heterogeneous devices are embedded in the epoxy resin to reconfigure the integration wafer. As the insulating layer and redistribution layer are formed by semiconductor wafer process without interposer substrate, the pseudo-SoC enables integration density and signal transmission speed as identical to that of SoC. Also, as the commercial LSI devices and peripheral passive components are able to use for the system integration, the pseudo-SoC enables reduction of time-to-market as identical that of SiP. This paper describes the heterogeneous devices integration technologies and focuses on the pseudo-SoC that overcomes the limitation of system integration and provides the complementary advantages of SiP and SoC with various applications.
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