The 20th Asia and South Pacific Design Automation Conference 2015
DOI: 10.1109/aspdac.2015.7058973
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A tri-level 50MS/s 10-bit capacitive-DAC for Bluetooth applications

Abstract: This document summarizes, for the university design contest, a chip design of a low power dissipation and small die area 10-bit capacitive digital-to-analog converter (DAC) in a 0.18 µm CMOS process. Power dissipation of this chip is 350 µW including the output buffers. The die area is 0.081mm 2 .

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