2017
DOI: 10.1016/j.mejo.2017.07.003
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A transimpedance amplifier for optical communication network based on active voltage-current feedback

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Cited by 33 publications
(15 citation statements)
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“…The proposed TIA in this paper has half the bandwidth reported in Seifouri et al and about 10 times less transimpedance gain but benefits from consuming 95% less power with higher input capacitance and less input referred noise. Moreover, the proposed TIA in this paper consumes the lowest power, while the input capacitance is relatively large in comparison with other references in Table , and the performance of the noise is better than circuits reported in the literature . These characteristics are obtained in cost of obtaining a narrower bandwidth and less transimpedance gain.…”
Section: Simulation Resultsmentioning
confidence: 87%
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“…The proposed TIA in this paper has half the bandwidth reported in Seifouri et al and about 10 times less transimpedance gain but benefits from consuming 95% less power with higher input capacitance and less input referred noise. Moreover, the proposed TIA in this paper consumes the lowest power, while the input capacitance is relatively large in comparison with other references in Table , and the performance of the noise is better than circuits reported in the literature . These characteristics are obtained in cost of obtaining a narrower bandwidth and less transimpedance gain.…”
Section: Simulation Resultsmentioning
confidence: 87%
“…In the recent years, researchers have discussed and analyzed different circuit structures and techniques to improve the performance of the TIA circuits for using in high‐speed communication applications. These techniques are as follows: f T doubler, shunt peaking, inductive peaking and series peaking technique, active feedback, 3D inductor serial peaking, slew boosting, Regulated Cascode (RGC), common‐drain feedback, T‐coil inductor matching, negative impedance compensation, double three‐order active feedback, stagger tuning, Л‐network, voltage‐current feedback, the zero and pole cancellation, and a three‐dimensional inductor converter . In addition, structures that are usually used as TIA building blocks to alleviate the bandwidth reduction are as follows: RGC structure, stagger tuning, and T‐coil inductor matching.…”
Section: Introductionmentioning
confidence: 99%
“…It is seen that the bandwidth and power dissipation of the proposed TIA are better than other TIA designs except. 1,6 However, the bandwidth of designs in 1,6 is high but at the cost of a larger chip area. The designs presented in 15,21 occupy a lesser area than the proposed TIA but these designs dissipate more power.…”
Section: Simulation Resultsmentioning
confidence: 99%
“…The main design limitation of TIA is to achieve wide bandwidth because of its input photodiode capacitance. Several design techniques have been reported to relax this parasitic effect such as inductive peaking, [1][2][3][4][5][6][7] inductive feedback, 8 common-gate (CG) input configuration, 9,10 regulated cascode (RGC), [11][12][13] negative impedance, 14,15 capacitive feedback, 16,17 capacitive degeneration, 18,19 multi-path TIAs, 20 and shunt feedback. 21 The inductive peaking technique is commonly used to increase the bandwidth, which inevitably increases the chip area consumption.…”
Section: Introductionmentioning
confidence: 99%
“…In this work, active voltage-current feedback TIA topology [15] is used which provides low input and output impedances. In this topology, thegain enhancing pathis introduced insuch a way that it increases both gain and bandwidth.…”
Section: Introductionmentioning
confidence: 99%