A Three-Dimensional Vertically Aligned Functionalized Multilayer Graphene Architecture: An Approach for Graphene-Based Thermal Interfacial Materials

Abstract

Thermally conductive functionalized multilayer graphene sheets (fMGs) are efficiently aligned in large-scale by a vacuum filtration method at room temperature, as evidenced by SEM images and polarized Raman spectroscopy. A remarkably strong anisotropy in properties of aligned fMGs is observed. High electrical (∼386 S cm(-1)) and thermal conductivity (∼112 W m(-1) K(-1) at 25 °C) and ultralow coefficient of thermal expansion (∼-0.71 ppm K(-1)) in the in-plane direction of A-fMGs are obtained without any reduction process. Aligned fMGs are vertically assembled between contacted silicon/silicon surfaces with pure indium as a metallic medium. Thus-constructed three-dimensional vertically aligned fMG thermal interfacial material (VA-fMG TIM) architecture has significantly higher equivalent thermal conductivity (75.5 W m(-1) K(-1)) and lower contact thermal resistance (5.1 mm2 K W(-1)), compared with their counterpart from A-fMGs that are recumbent between silicon surfaces. This finding provides a throughout approach for a graphene-based TIM assembly as well as knowledge of vertically aligned graphene architectures, which may not only facilitate graphene's application in current demanding thermal management but also promote its widespread applications in electrodes of energy storage devices, conductive polymeric composites, etc.

Scalable One‐Step Wet‐Spinning of Graphene Fibers and Yarns from Liquid Crystalline Dispersions of Graphene Oxide: Towards Multifunctional Textiles

“…7b). Whilst the room temperature thermal conductivity for our rGO fibers (1435 W m -1 K -1 ) is significantly higher than LC wetspun CNT fibers (20 W m -1 K -1 ), [18] magnetically aligned CNT films (~220 W m -1 K -1 ) [41] and graphene-based paper (~112 W m -1 K -1 ), [42] it is however, lower than single layer pristine graphene (up to 5300 W m -1 K -1 ). [43,44] Interestingly, it is also higher than polycrystalline graphite (200 W m -1 K -1 ).…”

Thermal Transport on Graphene-Based Thin Films Prepared by Chemical Exfoliations from Carbon Nanotubes and Graphite Powders

“…Recently, one-and two-dimensional carbon nanostructures-especially carbon nanotubes (CNTs) and graphene nanosheets (GNs)-have attracted a great deal of scientific and technological attention, owing to their extraordinary electrical and thermal properties, exhibiting their applicable feasibility [1,2]. Both CNTs and GNs have been demonstrated to display high theoretical thermal conductivities (k), thus heralding beneficial applications in heat exchangers and thermal management systems.…”

“…Both CNTs and GNs have been demonstrated to display high theoretical thermal conductivities (k), thus heralding beneficial applications in heat exchangers and thermal management systems. It is generally recognized that low-temperature operation and efficient heat dissipation are key factors in determining the lifetime and the speed in current electronic and photonic devices [1,3]. Industrially, the most commonly-used materials for heat sinks are still Al and Cu, which possess lower k values and higher true densities, as compared to carbonaceous materials.…”

“…However, an obvious gap exists between the actual k values of GN-based layers or heat sinks and the theoretical ones. As to the nano-structured carbons, the k values reported thus far include aligned functionalized multilayer GN architecture (112 W/m K at 298 K) [1], three-dimensional CNT/GN framework (1991 W/m K at 323 K) [2], graphene nanoribbons (2300 W/m K at 300 K) [7], GN-Cu-GN heterogeneous films (373 W/m K at 300 K) [10], and N-doped GN/Cu composite film (543 W/m K) [11]. The major gap can be attributed to the fact that the efficiency of thermal transport is mainly influenced by the presence of topological defects, surface roughness, surface heterogeneity, and porosity in carbon-based heat sinks [7].…”

Texture-controlled hybrid materials fabricated using nanosecond technology

“…1)3) However, the ongoing miniaturization and integration of power-intensive devices results in thermal management problems affecting the performance, reliability and stabilization of devices. 4) For example, the temperature rise in photovoltaic solar cells reduces the produced power by ³20% due to heat build-up and corresponds to an efficiency loss of 0.5% per 1°C increase in the temperature of the cell. 5) Materials ideal for effective thermal management should have high thermal conductivity and high electrical insulation.…”