A three-dimensional thermal-fluid analysis of flat heat pipes

Xiao, Bin; Faghri, Amir

doi:10.1016/j.ijheatmasstransfer.2007.08.023

Cited by 84 publications

(42 citation statements)

References 12 publications

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“…The linear model assumed negligible thermal resistance due to vapor convection, and treated the vapor as a common interface between the evaporator and condenser wicks; the utility and accuracy of the model were later demonstrated through analysis of a complete thermal heat sink package with an embedded vapor chamber [112]. Additional detailed, three-dimensional numerical models that solved for flow and heat transport in vapor chambers were presented by Koito et al [113] and Xiao and Faghri [114]. …”

Section: Numerical Modeling Approachesmentioning

confidence: 99%

Recent Advances in Vapor Chamber Transport Characterization for High-Heat-Flux Applications

Weibel

Garimella

2013

Advances in Heat Transfer

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Owing to their high reliability, simplicity of manufacture, passive operation, and effective heat transport, flat heat pipes and vapor chambers are used extensively in the thermal management of electronic devices. The need for concurrent size, weight, and performance improvements in high-performance electronics systems, without resort to active liquid-cooling strategies, demands passive heat spreading technologies that can dissipate extremely high heat fluxes from small hot spots. In response to these daunting application-driven trends, a number of recent investigations have focused on the design, characterization, and fabrication of ultra-thin vapor chambers for proximate heat spreading away from these hot spots. The predominant transport mechanisms and operational limits have been found to be different under these conditions relative to conventional low-power heat pipes. Noteworthy advances in the fundamental understanding of evaporation and boiling from porous microstructures fed by capillary action, and improvements in vapor chamber characterization, modeling, design, and fabrication techniques are reviewed. Characterization of evaporation and boiling from idealized and realistic wick structures, observation of vapor formation regimes as a function of operating conditions, assessment of fluid dryout limitations, design of novel multi-scale and nanostructured wicks for enhanced transport, and incorporation of these high heat flux transport phenomena into device-level models are discussed. These recent developments have successfully extended the maximum operating heat flux limits of vapor chambers.2

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Section: Numerical Modeling Approachesmentioning

confidence: 99%

Recent Advances in Vapor Chamber Transport Characterization for High-Heat-Flux Applications

Weibel

Garimella

2013

Advances in Heat Transfer

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“…In the inner section of the heat pipe, it was assumed that the liquid-vapour interface temperature is equal to the vapour saturation temperature of the working fluid that can be calculated from ClausiusClapeyron relationship [19]. Similarly, the liquid velocity at the interface of the wick layer-evaporator wall was assumed to equal zero.…”

Section: Advances In Mechanical Engineeringmentioning

confidence: 99%

Simulation and Experimental Investigation of Thermal Performance of a Miniature Flat Plate Heat Pipe

Boukhanouf

Haddad²

2013

Advances in Mechanical Engineering

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This paper presents the results of a CFD analysis and experimental tests of two identical miniature flat plate heat pipes (FPHP) using sintered and screen mesh wicks and a comparative analysis and measurement of two solid copper base plates 1 mm and 3 mm thick. It was shown that the design of the miniature FPHP with sintered wick would achieve the specific temperature gradients threshold for heat dissipation rates of up to 80 W. The experimental results also revealed that for localised heat sources of up to 40 W, a solid copper base plate 3 mm thick would have comparable heat transfer performances to that of the sintered wick FPHP. In addition, a marginal effect on the thermal performance of the sintered wick FPHP was recorded when its orientation was held at 0 ∘ , 90 ∘ , and 180 ∘ and for heat dissipation rates ranging from 0 to 100 W.

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“…For other capillary structures (mainly meshes, sintered powder wicks or crossed grooves), such an approach is not possible. The flow in the capillary structure is modelled by the Darcy's law in 2D [10] or 3D [11,12].…”

Section: Introductionmentioning

confidence: 99%

Physical mechanisms involved in grooved flat heat pipes: Experimental and numerical analyses

Lips

Lefèvre

Bonjour

2011

International Journal of Thermal Sciences

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An experimental database, obtained with flat plate heat pipes (FPHP) with longitudinal grooves is presented. The capillary pressure measured by confocal microscopy and the temperature field in the wall are presented in various experimental conditions (vapour space thickness, filing ratio, heat transfer rate, tilt angle, fluid). Coupled hydrodynamic and thermal models are developed. Experimental results are compared to results of numerical models. Physical mechanisms involved in grooved heat pipes are discussed, including the boiling limit and the effect of the interfacial shear stress. Finally, recommendations for future experimental and theoretical research to increase the knowledge on FPHP are discussed.

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A three-dimensional thermal-fluid analysis of flat heat pipes

Cited by 84 publications

References 12 publications

Recent Advances in Vapor Chamber Transport Characterization for High-Heat-Flux Applications

Recent Advances in Vapor Chamber Transport Characterization for High-Heat-Flux Applications

Simulation and Experimental Investigation of Thermal Performance of a Miniature Flat Plate Heat Pipe

Physical mechanisms involved in grooved flat heat pipes: Experimental and numerical analyses

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