A TGA study correlating polymer characteristics with smoke and flammability properties of polyester and phenolic resins

Morchat, Richard M.; Hiltz, John A.

doi:10.1016/0040-6031(91)87164-r

Cited by 6 publications

(1 citation statement)

References 17 publications

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“…Heat resistance and thermal properties of phenolic resins (PRs) are superior to most polymers, i.e., for epoxy resins, decomposition is significant already at 430 K, whereas PRs are stable up to 530 K, therefore they are more suitable for manufacturing materials for hightemperature applications. Due to the increased heat and fire resistance, as well as chemical stability, PR-based materials are used in applications that require excellent fire safety properties, i.e., in the production of power supply modules, airspace components, vacuum devices [38,39]. Nevertheless, published data on PR-based, heat-conductive composites, including h-BN/PR-system, are scarce.…”

Section: Introductionmentioning

confidence: 99%

Excellent Thermal and Dielectric Properties of Hexagonal Boron Nitride/Phenolic Resin Bulk Composite Material for Heatsink Applications

et al. 2023

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In the present paper, we report polymer composites based on phenolic resin filled with hexagonal boron nitride; hot compression molding coupled with solution-based mixing were used to manufacture the composites. The paper presents experimental results on the physical and physicochemical properties of the obtained composites: thermal stability in air and argon, dielectric constant and dielectric loss tangent, active electrical resistance, thermal conductivity (mean and anisotropy), and mechanical strength. It is shown that the proposed technique of composite manufacturing, including the application of high-process pressures, makes it possible to obtain materials with high anisotropy of thermal conductivity, extremely high-filler content, and excellent dielectric properties, all of which are very important for prospective highly efficient lightweight heatsink elements for electronic devices. Experimental values of thermal conductivity and dielectric constant were analyzed using known mathematical models. Experimental values for thermal conductivities (up to 18.5 W·m−1·K−1) of composites at filler loadings of 65–85 vol.% are significantly higher than published data for bulk boron nitride/polymer composites.

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Section: Introductionmentioning

confidence: 99%

Excellent Thermal and Dielectric Properties of Hexagonal Boron Nitride/Phenolic Resin Bulk Composite Material for Heatsink Applications

et al. 2023

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Effect of thermal exposure on the properties of phenolic composites: Dynamic mechanical analysis

Hiltz¹,

Kuzak

Waitkus³

2000

J. Appl. Polym. Sci.

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Changes in the dynamic response of glass‐reinforced phenolic composites following thermal exposure at 180oC for periods of time up to 28 days were monitored using dynamic mechanical analysis. Four phenolic resins were investigated: a resol/novolac blend, a phenolic–furan novolac/resol graft copolymer, a novolac, and a resol. Reactive blending and copolymerization of phenolic resins are currently being investigated to determine if these techniques will produce phenolic resins (and composites) that have improved impact properties and retain the excellent high‐temperature properties of resol and novolac phenolic resins. The results indicate that thermal aging at 180oC for 1 day led to a more complete cure of all four phenolic resins as indicated by an increase in the temperature of the maximum of plots of both loss modulus (E″) and tan δ versus temperature. The storage modulus (E′) of the composites at 40oC varied little following thermal aging at 180oC for 1 day but decreased with increasing exposure time for samples aged 2, 7, and 28 days. Thermal aging led to an increase in E′ at higher temperatures and the magnitude of E′ at a given temperature decreased with increasing exposure time. The magnitude of E″ and tan δ decreased with aging time for all resins, although E″ and tan δ were larger for the blend and copolymer composites than for the novolac and resol composites. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 79: 385–395, 2001

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Effect of Temperature Exposure on the Flexural Mechanical Behavior of Two Pultruded Composites

d’Almeida

2018

Fire Technol

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A TGA study correlating polymer characteristics with smoke and flammability properties of polyester and phenolic resins

Cited by 6 publications

References 17 publications

Excellent Thermal and Dielectric Properties of Hexagonal Boron Nitride/Phenolic Resin Bulk Composite Material for Heatsink Applications

Excellent Thermal and Dielectric Properties of Hexagonal Boron Nitride/Phenolic Resin Bulk Composite Material for Heatsink Applications

Effect of thermal exposure on the properties of phenolic composites: Dynamic mechanical analysis

Effect of Temperature Exposure on the Flexural Mechanical Behavior of Two Pultruded Composites

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