A Test Rig for Thermal Analysis of Heat Sinks for Power Electronic Applications
Andrew Sharp,
Shafiul Monir,
Richard J. Day
et al.
Abstract:This paper discusses the design and manufacture of a test rig for practical thermal analysis of the temperature distribution across forced air-cooled heat sinks. Hightemperature gradients across power electronic modules that have a large area of semiconductor structure can result in premature failure of the components due to mechanical stressrelated fatigue. Computer modelling and simulations predict the temperature distribution across the heat sink, but physical temperature measurements are required to valida… Show more
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