| In recent years, important progress has been made in developing design strategies, materials, and associated assembly techniques that provide empowering approaches to electronics with unconventional formats, ones that allow useful but previously hard to realize attributes of function. Notable examples of the progress made include: light weight, large area, high performance electronics, optics, and photonics; electronic and optical systems with curvilinear shapes and capacities for accommodating demanding forms of mechanical flexure; new device form factors for use in sensing and imaging; the integration of high performance electronics in 3-D with demanding nanometer design rules; functional bioresponsive electronics; and advanced hybrid materials systems for lighting, energy storage, and photovoltaic energy conversion. In this report we highlight advances that are enabling such promising capabilities in technologyVspecifically, the fabrication of device elements using high performance inorganic electronic materials joined with printing and transfer methods to effect their integration within functional modules.We emphasize in this review considerations of the design strategies and assembly techniques that, when taken together, circumvent limitations imposed by approaches that integrate circuit elements within compact, rigid, and essentially planar form factor devices, and provide a transformational set of capabilities for high performance flexible/stretchable electronics. Fig. 1. Material configurations and structural layouts for flexible/stretchable electronics. (a) Aligned arrays of 1-D Ge/Si core/shell nanowire arrays, here used as the channel materials for active-matrix FETs supported on a polyimide substrate. Reproduced with permission from [28]. Copyright American Chemical Society. (b) Patterned 2-D silicon nanoribbons undercut and delaminated from a Silicon-on-Insulator (SOI) wafer using an isotropic wet-chemical etch of the buried oxide layer. Reproduced with permission from [35]. Copyright The American Association for the Advancement of Science. (c) Ag nanoparticles patterned by direct-ink writing on a paper substrate. Reproduced with permission from [41]. Copyright John Wiley and Sons. (d) Buckled layout of printed silicon ribbons upon release of prestrain in the elastomeric (PDMS) substrate. Reproduced with permission from [35]. Copyright The American Association for the Advancement of Science. (e) Planar Au filamentary serpentine interconnects on an elastomeric substrate before (upper panel) and after (lower panel) compression. Reproduced with permission from [48]. Copyright IEEE. (f) Out-of-plane bridge interconnects for semiconductor circuits illustrating 3-D structural motifs formed by strain-minimizing release dynamics Reproduced with permission from [51]. Copyright National Academy of Sciences, USA. (g) High performance GaAs solar microcells interconnected by filamentary gold wires patterned in an open mesh layout to accommodate large amplitude strain evolution in the supporting substrate. Repro...