A TCAD comparative study of power rectifiers: modified P–i–N vs. modified mosaic contact P–i–N diode

Aldrete-Vidrio, H.E.; Valle, J.L. Del; Santana-Corte, J.

doi:10.1016/s0026-2714(02)00287-1

Cited by 2 publications

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p⁺−n⁻−n⁺-type power diode with crystalline/nanocrystalline Si mosaic electrodes

Wei

Zhang

2016

J. Semicond.

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Using p+-type crystalline Si with n+-type nanocrystalline Si (nc-Si) and n+-type crystalline Si with p+-type nc-Si mosaic structures as electrodes, a type of power diode was prepared with epitaxial technique and plasma-enhanced chemical vapor deposition (PECVD) method. Firstly, the basic p+−n−−n+-type Si diode was fabricated by epitaxially growing p+- and n+-type layers on two sides of a lightly doped n−-type Si wafer respectively. Secondly, heavily phosphorus-doped Si film was deposited with PECVD on the lithography mask etched p+-type Si side of the basic device to form a component with mosaic anode. Thirdly, heavily boron-doped Si film was deposited on the etched n+-type Si side of the second device to form a diode with mosaic anode and mosaic cathode. The images of high resolution transmission electronic microscope and patterns of X-ray diffraction reveal nanocrystallization in the phosphorus- and boron-deposited films. Electrical measurements such as capacitance–voltage relation, current-voltage feature and reverse recovery waveform were carried out to clarify the performance of prepared devices. The important roles of (n−)Si/(p+)nc-Si and (n−)Si/(n+)nc-Si junctions in the static and dynamic conduction processes in operating diodes were investigated. The performance of mosaic devices was compared to that of a basic one.

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