A survey of surface mount device placement machine optimisation: Machine classification

Ayob, Masri; Kendall, Graham

doi:10.1016/j.ejor.2007.03.042

Cited by 77 publications

(29 citation statements)

References 73 publications

(166 reference statements)

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“…Since the optimisation of the pick-and-place operations is machine dependent, no general formulation can be defined for optimising the pick-and-place operations. However, one general formulation can be derived for each machine type as classified in Ayob and Kendall (2008).…”

Section: Discussionmentioning

confidence: 99%

“…Many other types of machines are now available including sequential pick-and-place, rotary disk turret, concurrent pickand-place, dual-delivery, multi-station, multi-head, etc. (Grotzinger 1992;Khoo and Loh 2000;Gastel 2002;Ayob and Kendall 2008). As different SMD machines exhibit different characteristics, Wang, Nelson and Tripak (1999), Burke, Cowling and Keuthen (2001) and Ayob and Kendall (2008) argued that the PCB scheduling process is heavily influenced by the particular SMD machine being used.…”

Section: The Smd Placement Machinementioning

confidence: 99%

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The optimisation of the single surface mount device placement machine in printed circuit board assembly: a survey

Ayob

Kendall

2009

International Journal of Systems Science

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This article surveys research on the single surface mount device (SMD) placement machine optimisation problem. We classify the optimisation problem into five sub-problems: feeder setup, component placement sequencing, nozzle optimisation, component retrieval plan and motion control; and analyse issues relevant to each of these. One of the aims of this article is to provide guidance to other researchers and gain a deeper understanding of the various optimisation issues that arise in this domain. This could lead to the design of improved heuristics, which are more appropriate to the real-world scheduling problem of the SMD placement machine.

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Section: Discussionmentioning

confidence: 99%

Section: The Smd Placement Machinementioning

confidence: 99%

The optimisation of the single surface mount device placement machine in printed circuit board assembly: a survey

Ayob

Kendall

2009

International Journal of Systems Science

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“…The first is that beam travelling distance is becoming a less significant factor due to the fast speed of the beam in the latest machines and the increasing density of components on PCBs. Moreover, because of the acceleration/ deceleration rate of the beam, the time taken for the beam to move shorter or longer distances might be almost the same (Ayob 2005;Ayob and Kendall 2008). Based on these statements, the average machine operation time is utilized here to calculate the cycle time.…”

mentioning

confidence: 99%

“…This paper assumes that the number of NTs needed is less than the total number of heads on the beam. In this circumstance, some of the NTs may be duplicated to be assigned to heads (hereafter named duplicated NTs situation), and the timeconsuming nozzles change operation (Ayob and Kendall 2008) can be avoided. Component allocation problem is how to allocate components of CTs to several placement machines in the assembly line.…”

mentioning

confidence: 99%

PCB assembly scheduling with alternative nozzle types for one component type

2011

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The placement machine is the bottleneck of a printed circuit board (PCB) assembly line. The type of machine considered in this paper is the beam-type placement machine that can simultaneously pick up several components from feeders. It is assumed that the number of nozzle types (NTs) is less than the number of heads on the beam. The objective of the PCB assembly scheduling for a single placement machine is to minimize the cycle time based on the average machine operation time instead of the travelling distance. To minimize the cycle time, the number of turns and the number of pickups should be minimized. The PCB assembly scheduling is hierarchically decomposed into four problems: the nozzle assignment problem, the head allocation problem, the component type (CT) grouping problem and the pickup clustering problem, which are optimized successively and iteratively. First, the nozzle assignment problem considering alternative NTs for one CT is dealt with by the proposed genetic algorithm. For a given nozzle assignment solution, the head allocation problem is solved by a previously greedy heuristic to minimize the number of turns.Then, the CT grouping problem and the pickup clustering problem are solved by a proposed greedy heuristic and a modified agglomerative hierarchical clustering approach, respectively, to minimize the number of pickups. Numerical experiments are carried out to examine the performances of these proposed heuristic approaches. The importance of considering alternative NTs for one CT for the cycle time is also confirmed.

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“…Processes of SMT assembly lines usually involve welding paste, placement of components and the operations of Reflow Welding [11]. The Reflow welding process consists of heating up the whole mounted board to liquefy the solder paste to form welding unions between SMDs and PCB without altering the original characteristics of the electric components.…”

Section: Description Of the Welding Process Of The Bga Componentmentioning

confidence: 99%

Analysis of the quality of the welding process in the exchange of component of BGA technology

Marques-Costa

Silva-Vieira

Pereira-Lopes

et al. 2015

Rev. Fac. Ing. Antioquia

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A survey of surface mount device placement machine optimisation: Machine classification

Cited by 77 publications

References 73 publications

The optimisation of the single surface mount device placement machine in printed circuit board assembly: a survey

The optimisation of the single surface mount device placement machine in printed circuit board assembly: a survey

PCB assembly scheduling with alternative nozzle types for one component type

Analysis of the quality of the welding process in the exchange of component of BGA technology

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