A surrogate assisted thermal optimization framework for design of pin-fin heat sink for the platform inertial navigation system

Abstract

In this study, in order to reduce the local high temperature of the platform in inertial navigation system (PINS), a pin-fin heat sink with staggered arrangement is designed. To reduce the dimension of the inputs and improve the efficiency of optimization, a feasible global sensitivity analysis (GSA) based on Kriging-High Dimensional Model Representation with DIviding RECTangles sampling strategy (DIRECT-KG-HDMR) is proposed. Compared with other GSA methods, the proposed method can indicate the effects of the structural and the material parameters on the maximum temperature at the bottom of the heat sink by using both sensitivity and coupling coefficients. From the results of GSA, it can be found that the structural parameters have greater effects on thermal performance than the material ones. Moreover, the coupling intensities between the structural and material parameters are weak. Therefore, the structural parameters are selected to optimize the thermal performance of the heat sink, and several popular optimization algorithms such as GA, DE, TLBO, PSO and EGO are used for the optimization. Moreover, steady thermal response of the PINS with the optimized heat sink is also studied, and its result shows that the maximum temperature of high temperature region of the platform is reduced by 1.09 ℃ compared with the PINS without the heat sink.

The Influence of Geometry, Surface Texture, and Cooling Method on the Efficiency of Heat Dissipation through the Heat Sink—A Review

“…The authors noted that the heat sink with a rectangular cross-section had the best thermal properties, while the heat sink with a trapezoidal cross-section had the worst properties in terms of thermal resistance, pressure drop, and pumping power. Several papers have been so far published that address the optimization of cooling systems, both experimentally [7][8][9][10][11][12]16,19,[26][27][28][29][30][31][32][33][34][38][39][40][41]43,54,56,58,62] and analytically or based on simulations [4][5][6][7][8][9][13][14][15][16][17][18][19][20][22][23][24][25][26][28][29][30]…”

“…The operating temperature should not be exceeded during typical operation under nominal operating conditions, defined as thermal resistance [1][2][3]. The type of cooling system used-active (forced) [4][5][6][7][8][9][10][11][12][13][14][15][16][17][18][19][20][21][22]/passive and the selection of material [11][12][13][14][15][35][36][37][38][39][52][53][54] from which the heat exchanger (heat sink) is made-depends primarily on the amount of generated heat, the heating power of the source, and the method of heat transfer to the environment. The ambient conditions in which the cooling system operates are also important: temperature, humidity, flow rate of the cooling medium (e.g., air, water, or other coolants), the possibility of fouling a heat sink with dust and deposits, etc.…”

“…Heat sinks have found particular use in electronics [9][10][11]15,21,26,[34][35][36][37][47][48][49][50][51][52]58]. However, they are also used in various fields of industry, including the cooling of photovoltaic systems [16], battery thermal management systems [17], platform inertial navigation systems [18] in space engineering applications [19], the cooling of semiconductor chips [22], in air dryers [26], lighting systems [8], and thermoelectric generators [59].…”

“…Materials 2023, 16, 5348 2 of 20 photovoltaic systems [16], battery thermal management systems [17], platform inertial navigation systems [18] in space engineering applications [19], the cooling of semiconductor chips [22], in air dryers [26], lighting systems [8], and thermoelectric generators [59].…”

“…An examples of commonly used heatsinks are presented in the Figure 1. Several papers have been so far published that address the optimization of cooling systems, both experimentally [7][8][9][10][11][12]16,19,[26][27][28][29][30][31][32][33][34][38][39][40][41]43,54,56,58,62] and analytically or based on simulations [4][5][6][7][8][9][13][14][15][16][17][18][19][20][22][23][24][25][26][28][29][30][31]…”