2007
DOI: 10.1007/s10008-007-0285-5
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A surface adsorption model for electroless cobalt alloy thin films

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Cited by 24 publications
(20 citation statements)
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“…Cobalt alloys with low soluble dopants form structures that may be used as diffusion barriers and capping layers preventing contamination by copper. [2][3][4][5] Electroless cobalt baths that use hypophosphite ions as a reducing agent can deposit coatings containing 4-8 at.% of phosphorus. 5 Boron containing compounds (sodium and potassium borohydrides NaBH 4 and KBH 4 or borazanes R x NH y BH xzy , where R is an organic group such as methyl or ethyl) are stronger reducing agents as compared to hypophosphites.…”
Section: Introductionmentioning
confidence: 99%
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“…Cobalt alloys with low soluble dopants form structures that may be used as diffusion barriers and capping layers preventing contamination by copper. [2][3][4][5] Electroless cobalt baths that use hypophosphite ions as a reducing agent can deposit coatings containing 4-8 at.% of phosphorus. 5 Boron containing compounds (sodium and potassium borohydrides NaBH 4 and KBH 4 or borazanes R x NH y BH xzy , where R is an organic group such as methyl or ethyl) are stronger reducing agents as compared to hypophosphites.…”
Section: Introductionmentioning
confidence: 99%
“…[2][3][4][5] Electroless cobalt baths that use hypophosphite ions as a reducing agent can deposit coatings containing 4-8 at.% of phosphorus. 5 Boron containing compounds (sodium and potassium borohydrides NaBH 4 and KBH 4 or borazanes R x NH y BH xzy , where R is an organic group such as methyl or ethyl) are stronger reducing agents as compared to hypophosphites. 6 Co (and Ni) thin electrolessly deposited films with boron have higher hardness, better corrosion resistance compared to those of Co (or Ni) films codeposited with phosphorus.…”
Section: Introductionmentioning
confidence: 99%
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