2017
DOI: 10.1016/j.mssp.2017.02.003
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A substrate removal processing method for III–V solar cells compatible with low-temperature characterization

Abstract: In this work, we present a substrate removal procedure for solar cells compatible with direct attachment of the epitaxy to a holder through a thermally and electrically conductive interface. In our case this procedure was motivated by the need to develop a processing technique compatible with lowtemperature characterization of the devices. The method is based on the use of indium to bond a thin-film epitaxial structure to a silicon support. The adequate properties of indium, namely, low tensile strength and go… Show more

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References 41 publications
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