A study on the heat dissipation of high power multi-chip COB LEDs

Wu, Hsueh-Han; Lin, Kuan‐Hong; Lin, Shun‐Tian

doi:10.1016/j.mejo.2012.01.007

Cited by 102 publications

(32 citation statements)

References 25 publications

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“…The test chamber consisted of EPS insulation (50 mm) and plywood (9 mm), and the inner space was 0.8 m wide, 0.8 m long, and 0.8 m high. In the LED lighting system, a chip-on-board (COB) packaged LED, which was 40 mm in width and 40 mm in length, was used to enhance heat transfer efficiency because of high heat flux in a small area [25,26]. The luminous flux of the LED was 5800 lm with 5700 K color temperature, and more than 95 lm/W in luminous efficiency at the 60 W output power.…”

Section: Methodsmentioning

confidence: 99%

Savings in Cooling Energy with a Thermal Management System for LED Lighting in Office Buildings

et al. 2015

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Light-emitting diode (LED) lighting should be considered for lighting efficiency enhancement, however, waste heat from light-emitting diode (LED) lighting increases the internal cooling load during the summer season. In order to solve this problem we propose a thermal management system for light-emitting diode (LED) lighting with a heat exchanger module integrated with the building's heating, ventilation, and air conditioning (HVAC) system to move the lighting's waste heat outdoors. An experiment was carried out to investigate the thermal effects in a test chamber and the heat exchange rate between the heat sink and the duct air. The heat generated by the light-emitting diode (LED) lighting was calculated as 78.1% of light-emitting diode (LED) input power and the heat exchange rate of the lighting heat exchange module was estimated to be between 86.5% and 98.1% according to the light-emitting diode (LED) input power and the flow rate of air passing the heat sink. As a result, the average light-emitting diode (LED) lighting heat contribution rate for internal heat gain was determined as 0.05; this value was used to calculate the heating and cooling energy demand of the office building through an energy simulation program. In the simulation results, the cooling energy demand was reduced by 19.2% compared with the case of conventionally installed light-emitting diode (LED) lighting. OPEN ACCESSEnergies 2015, 8 6659

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Section: Methodsmentioning

confidence: 99%

Savings in Cooling Energy with a Thermal Management System for LED Lighting in Office Buildings

et al. 2015

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“…Compared to the SMT high power LED array, COB array has many advantages on cost packaging densities and thermal management. Thermal management of LED array includes three areas: the package level, the board level and the system level [14]. At the package level, Yung [15] proposed a new placement configuration for the LED array which can lower down the LED temperature.…”

Section: Introductionmentioning

confidence: 99%

“…To avoid copper circuit conduction with metal layer, insulation must be added between these two layers. In most applications [14], the metal base is attached to the heat sink with thermal grease and screws. In this way, the distribution of stresses is nonuniform which leads to crack between chip and sink [22].…”

Section: Introductionmentioning

confidence: 99%

Thermal analysis of COB array soldered on heat sink

Chen

Liu

et al. 2014

International Communications in Heat and Mass Transfer

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“…�ecause of the high heat �ux density produced by high friction between the �ying slider and the rotating disk, the anomalous heat conduction of the gas thin layer in between restricts actual improvements of storage capacity of hard disk. Additionally heat managements and performance optimizations for electronic integrated circuit chips demands as well clear understandings of heat transport mechanism of gas layers at micro-and nanoscales [7][8][9][10][11][12].…”

Section: Introductionmentioning

confidence: 99%

“…erefore heat transfer at micro-and nanoscales has been of great interests in the past ten years [1,2,5,[7][8][9][10][12][13][14][15]. Heat transfer in thin gas layers differs from that at large scale.…”

Section: Introductionmentioning

confidence: 99%

Understanding of Thermal Conductance of Thin Gas Layers

Shan

Wang

2013

Advances in Mechanical Engineering

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We studied heat conductions in a thin gas layer at micro-and nanoscales between two straight walls by atomistic modeling. Since the Knudsen number is high while the gas may be not really rare�ed, we use the generalized Enskog-Monte-Carlo method ��EMC� for simulations. e thermal conductivity of thin gas layer is reduced signi�cantly with the decreased thickness of gas layer. We examined a few possible causes including the rare�ed gas effect and the thermal inertia effect. �ur careful simulations indicate that the temperature �ump on wall surfaces and the properties changing signi�cantly by the con�ned space are two dominating factors to the thermal conductivity reduction of thin gas layers.

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A study on the heat dissipation of high power multi-chip COB LEDs

Cited by 102 publications

References 25 publications

Savings in Cooling Energy with a Thermal Management System for LED Lighting in Office Buildings

Savings in Cooling Energy with a Thermal Management System for LED Lighting in Office Buildings

Thermal analysis of COB array soldered on heat sink

Understanding of Thermal Conductance of Thin Gas Layers

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