A study on the geometry and shape effects on different aluminum fin types of a vertical cylindrical heat sink

Hameed, Vinous M.; Khaleel, Mohammed A.

doi:10.1007/s00231-019-02750-7

Cited by 13 publications

(5 citation statements)

References 8 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Copper (Kleiner et al, 1995), aluminum (Choquette et al, 1996;Hameed and Khaleel, 2020), and silicon (Zhimin and Fah) were used to study the influence of various structural materials on total thermal performance. Other materials such as stainless steel (Peng et al, 1994), glass (Koşar, 2010), and bronze (Gamrat et al, 2005) were used in a few efforts.…”

Section: Methodsmentioning

confidence: 99%

RETRACTED: Study of thermal characteristics of energy efficient micro channel heat sinks in advanced geometry structures and configurations: A review

et al. 2022

View full text Add to dashboard Cite

The sustainability and economic development is intertwined with the energy consumption and conversion processes. To suffice the ever-increasing demand of energy consumption amid environmental concerns, energy conservation and recovery along with the harnessing of renewable energy has been mandated by the policy regulators. In any energy conversion process, heat exchangers are vital operation component and has been part of any energy conversion process since the Nineteenth century. However, due to the increased energy demand, requirement of high efficiency and space and material constraints, the need for miniaturized light-weight heat exchangers with adequate heat transfer characteristics persists. Traditional heat exchangers are outdated because of its large space requirements and comparatively less heat removal rate. The miniaturized micro channel heat sink (MCHS) with tubes of about less than 1 mm have a tremendous potential to further enhance the heat transfer performance. However, its simple design doesn’t cope with the modern requirements of heat removal. Therefore, many researchers have tried to improve its performance using different techniques. The present study reviews some of the most important techniques applied to MCHS. These techniques include, coolant types used in MCHS, MCHS shapes, flow conditions, numerical methods used for this research, and materials used to manufacture MCHS. Moreover, some recommendations have been given to provide opportunities to researchers for future aspects.

show abstract

Section: Methodsmentioning

confidence: 99%

RETRACTED: Study of thermal characteristics of energy efficient micro channel heat sinks in advanced geometry structures and configurations: A review

et al. 2022

View full text Add to dashboard Cite

show abstract

“…The results are shown in Figure 10. It can be seen that the trend in Figure 10 is consistent with previous studies on this subject [31]. To obtain the chip heat flux in the FEM model, Equation (3) can be used:…”

Section: Experimental Measurementssupporting

confidence: 85%

“…Nonetheless, given that the gate voltage is continuously applied at its rated value and the gate remains activated, only conduction losses are present. Additionally, other It can be seen that the trend in Figure 10 is consistent with previous studies on this subject [31]. To obtain the chip heat flux in the FEM model, Equation (3) can be used:…”

Section: Experimental Measurementssupporting

confidence: 85%

Impact of Solder Voids on IGBT Thermal Behavior: A Multi-Methodological Approach

Alavi,

De Ceuninck,

Daenen

2024

Electronics

View full text Add to dashboard Cite

This study investigates the thermal behavior of Insulated Gate Bipolar Transistors (IGBTs) with a focus on the influence of solder voids within the device. Utilizing a combination of Finite Element Method (FEM) simulations, X-ray imaging, and SEM-EDX analysis, we accurately modeled the internal structure of IGBTs to assess the impact of void characteristics on thermal resistance. The findings reveal that the presence and characteristics of solder voids—particularly their size, number, and distribution—significantly affect the thermal resistance of IGBT devices. Experimental measurements validate the FEM model’s accuracy, confirming that voids disrupt the heat flow path, which can lead to increased thermal resistance and potential device failure. Five regression models, including Gaussian process regression (GPR) and neural networks, were employed to predict the thermal resistance based on void characteristics, with the GPR models demonstrating superior performance. The optimal GPR RQ model consistently provided accurate predictions with an RMSE of 0.0050 and R2 of 0.9728. Using the void percentage as the only input parameter for the regression models significantly impacted the prediction accuracy, showing the importance of the void extraction method. This study shows the necessity of minimizing solder voids and offers a robust methodological framework for a better prediction of the reliability of IGBTs.

show abstract

“…This in turn leads to the invention of a greater number of different types of heat sinks and out of which the performances of few works are as stated-that the average heat transfer coefficient, heat transfer rate increase with the reduction of weight in discrete fins and perforated fins compared to the solid fins block. The Nusselt number rises with an increase in heat input for all types (1)(2)(3)(4)(5)(6)(7) . Also found that Elliptical fin with elliptical perforation has maximum https://www.indjst.org/ efficiency (8) .…”

Section: Introductionmentioning

confidence: 99%

An Experimental Investigation on Performance of Heat Transfer Using Heat Sink of Different Shape for Electronic Applications

Sushma¹,

Chandrashekar²

2021

IJST

View full text Add to dashboard Cite

A study on the geometry and shape effects on different aluminum fin types of a vertical cylindrical heat sink

Cited by 13 publications

References 8 publications

RETRACTED: Study of thermal characteristics of energy efficient micro channel heat sinks in advanced geometry structures and configurations: A review

RETRACTED: Study of thermal characteristics of energy efficient micro channel heat sinks in advanced geometry structures and configurations: A review

Impact of Solder Voids on IGBT Thermal Behavior: A Multi-Methodological Approach

An Experimental Investigation on Performance of Heat Transfer Using Heat Sink of Different Shape for Electronic Applications

Contact Info

Product

Resources

About