A study on the electrical resistance of solder joint interconnections

Liu, De‐Shin; Ni, Ching-Yu

doi:10.1016/s0167-9317(02)00551-8

Cited by 17 publications

(6 citation statements)

References 12 publications

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“…It has been stated that electromigration is also impacted by the stress present in the bump [23]. It is also known that stress in the bump depends on its location in the bump array [24]. Thus, results shown above may be affected by the stress acting on the bump and hence it is necessary to consider effect of stress within the PO.…”

Section: Resultsmentioning

confidence: 99%

Flip chip back end design parameters to reduce bump electromigration

Karajgikar

Nagaraj

Agonafer

et al. 2008

2008 58th Electronic Components and Technology Conference

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The advancement in flip chip technology has enabled us to meet the requirement of smaller die size along with the increased functionality. Due to this development in flip chip packaging technology along with higher current carrying requirement of solder bumps, electromigration has now become a reliability concern. In this paper, a commercially available finite element tool is adopted in order to study the distribution of current density in eutectic solder bump for variety of back end design parameters. Parameters such as passivation opening (PO) diameter, trace width, under bump metallurgy (UBM) thickness and UBM diameter were studied in detail. The results were evaluated for input currents of 0.

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Section: Resultsmentioning

confidence: 99%

Flip chip back end design parameters to reduce bump electromigration

Karajgikar

Nagaraj

Agonafer

et al. 2008

2008 58th Electronic Components and Technology Conference

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“…From engineering and technological applications viewpoint, the major topic of interest is the overall electrical resistance of the interconnection used in microelectronic devices [59] or of the PV ribbon [60] used in connecting the Solar Photovoltaic cells. The interconnection and joints with lower electrical resistance are preferable for use in these applications.…”

Section: Computation Of Change In Electrical Resistance For the Multiphase Systemmentioning

confidence: 99%

Integration of machine learning with phase field method to model the electromigration induced Cu6Sn5 IMC growth at anode side Cu/Sn interface

Kunwar

Coutinho

Hektor

et al. 2020

Journal of Materials Science & Technology

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Currently, in the era of big data and 5G communication technology, electromigration has become a serious reliability issue for the miniaturized solder joints used in microelectronic devices. Since the effective charge number (Z*) is considered as the driving force for electromigration, the lack of accurate experimental values for Z* pose severe challenges for simulation-aided design of electronic materials. In this work, a data-driven framework is developed to predict the Z* values of Cu and Sn species at the anode based LIQUID, Cu6Sn5 intermetallic compound (IMC) and FCC phases for the binary Cu-Sn system undergoing electromigration at 523.15 K. The growth rate constants (kem) of the anode IMC at several magnitudes of applied low current density (j=1× 10 6 to 10 × 10 6 A/m 2 ) are extracted from simulations based on a 1D multi-phase field model. A neural network employing Z* and j as input features, whereas utilizing these computed kem data as the expected output is trained. The results of the neural network analysis are optimized with experimental growth rate constants to estimate the effective charge numbers. For negligible increase in temperature at low j values, effective charge numbers of all phases are found to increase with current density and the increase is much more pronounced for the IMC phase. The predicted values of effective charge numbers Z* are then utilized in a 2D simulation to observe the anode IMC grain growth and electrical resistance changes in the multi-phase system. As the work consists the aspects of experiments, theory, computation and machine learning, it can be called the four paradigms approach for study of electromigration in Pb-free solder. Such a combination of multiple paradigms of materials design can be problem-solving for any future research scenario that is marked by uncertainties regarding determination of material properties.

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“…Also, this type of experiment can be applied as a non-destructive technique for prediction of the solder joint´s end-of-life. Besides that, change of electrical resistivity of the solder joint on different surfaces is also studied in this work [13][14][15][16][17].…”

Section: Introductionmentioning

confidence: 99%

Influence of Multiple Reflows and Surface Finishes on Solder Joint Resistivity

Dzivy,

Pietrikova,

Vrublevskaya

et al. 2021

Acta Electrotechnica Et Informatica

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The main purpose of this paper is the analysis of the electrical resistivity of solder joints depending on various surface finishes and on the number of reflow processes. The electrical resistivity was determined after 1, 2, 3, 5 and 6 reflow cycles as a replacement for the basic accelerated aging test. In this article, various surface finishes are compared by measuring electrical resistivity of solder joints between two soldering pads. The influence of standard surface finishes (ENIG, Lead HASL, Lead-free HASL, Cu, ImSn) with the new developed surface finish based on SnAg7 is also compared. Measurements show that the electrical resistivity is dependent on surface finish type and the thickness of the solder joint. The results prove that the new developed surface finish based on SnAg7 is stable against multiple reflows and comparable to the surface finish based on Au. The new developed surface finish based on SnAg7 can be recommended as a replacement for other conventional surface finishes.

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A study on the electrical resistance of solder joint interconnections

Cited by 17 publications

References 12 publications

Flip chip back end design parameters to reduce bump electromigration

Flip chip back end design parameters to reduce bump electromigration

Integration of machine learning with phase field method to model the electromigration induced Cu6Sn5 IMC growth at anode side Cu/Sn interface

Influence of Multiple Reflows and Surface Finishes on Solder Joint Resistivity

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