A Study on Positive Photosensitive Epoxy Resins Using Reaction Development Patterning (RDP)

Abstract

In this study, we successfully fabricated positive photosensitive epoxy resins based on the Reaction Development Patterning (RDP) by using B-staged polymers prepared by polyaddition between an epoxy base resin and an acid anhydride curing agent during mixing and prebaking processes. Application of RDP to the B-staged polymers afforded positive fine patterns by the use of 15-mol% sodium 2-aminoethoxide in ethanolamine / NMP mixtures. Furthermore, the fine epoxy patterns were not deformed after heat treatment for complete curing, indicating that the cress-linked epoxy patterns have high tolerability to thermal stresses. These results suggest the possibility of practical application of RDP-based positive photosensitive epoxy resins.

Synthesis of UV and thermal dual curing oligomer for solder resist ink using ink‐jet printing

“…As thermosetting resins, epoxy resins are used across a wide range of fields, including in PCB industry because of their outstanding mechanical properties, high adhesion, and excellent thermal and chemical resistances . Chao and Zhen‐Guo synthesized a low viscosity epoxy resin using polyethylene glycol as a raw material for PCB solder resist ink for inkjet printing.…”

Utilization of Polyarylates Having Chemically Introduced Diazonaphthoquinone Structure for Reaction Development Patterning

“…Pattern formation by RDP is based on decrease in molecular weight induced by nucleophilic acyl substitution between -C(O)-X-bonds in the polymers and nucleophile in the developer, and preferential permeation of the developer into the photoirradiated areas is achieved by acid generated from DNQ by photo-irradiation ( Figure 1). RDP uses inherent -C(O)-X-bonds in engineering plastics for pattern formation, and therefore, a variety of engineering plastics including commercially available poly(ether imide), polycarbonate, and polyarylate (PAr) can be used as the polymer component of RDP without introducing additional functional groups [5][6][7][8][9][10][11][12][13][14][15][16][17][18][19][20][21].…”