2020
DOI: 10.5781/jwj.2020.38.2.1
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A Study on Joint Properties of Sn-Cu-(X)Al-(Y)Si/Cu Solder by Multiple Reflow

Abstract: Joint properties of Sn-Cu-(X)Al-(Y)Si lead-free solder alloy were investigated for automotive electronics module. In this study, Sn-0.5Cu-(0.01, 0.03)Al-0.005Si(wt.%) alloys were then fabricated in the form of solder balls for reflow samples. To evaluation of solder joint properties, solder ball was attached to PCB finished with OSP Cu pad. The reflow process was performed for 40 s above 260.5 ℃. And solder joint was evaluated by repeating the reflow process up to 10 times. The melting temperatures of Sn-0.7Cu… Show more

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“…As there was no TLP welding specification for 5A06 aluminum alloy, the selection of filler metal composition refers to the existing research in this study. Al-Cu-Si-Ni [17] is one of the typical brazing filler metal systems applied to the aluminum alloys, belonging to the Al-Cu-Si system. Cu and Si are used as melting point depressants (MPD) [18].…”
Section: Introductionmentioning
confidence: 99%
“…As there was no TLP welding specification for 5A06 aluminum alloy, the selection of filler metal composition refers to the existing research in this study. Al-Cu-Si-Ni [17] is one of the typical brazing filler metal systems applied to the aluminum alloys, belonging to the Al-Cu-Si system. Cu and Si are used as melting point depressants (MPD) [18].…”
Section: Introductionmentioning
confidence: 99%