A study on interfacial phase evolution during Cu/Sn/Cu soldering with a micro interconnected height

Yao, Peng; Li, Xiaoyan; Liang, Xidong; Yu, Bo; Jin, Fengyang; Li, Yang

doi:10.1016/j.matchar.2017.06.033

Cited by 30 publications

(16 citation statements)

References 57 publications

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“…al [10], Orchard et. al [11], and the recent study by Yao et al [12] show the distinct characteristics of the EM/TM-mediated IMC growth at the anode and cathode layers and depict the morphological changes due to large mass fluxes. The analytical discussion on the impact of EM flux on the evolution of IMC layers by above studies does not distinguish the distinct nature of the interchange between the Cu 3 Sn and Cu 6 Sn 5 layers.…”

Section: Introductionmentioning

confidence: 89%

On the interfacial phase growth and vacancy evolution during accelerated electromigration in Cu/Sn/Cu microjoints

et al. 2018

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In this work, we integrate different computational tools based on multi-phase-field simulations to account for the evolution of morphologies and crystallographic defects of Cu/Sn/Cu sandwich interconnect structures that are widely used in three dimensional integrated circuits (3DICs). Specifically, this work accounts for diffusion-driven formation and disappearance of multiple intermetallic phases during accelerated electromigration and takes into account the non-equilibrium formation of vacancies due to electromigration. The work compares nucleation, growth, and coalescence of intermetallic layers during transient liquid phase bonding and virtual joint structure evolution subjected to accelerated electromigration conditions at different temperatures. The changes in the rate of dissolution of Cu from intermetallics and the differences in the evolution of intermetallic layers depending on whether they act as cathodes or anodes are accounted for and are compared favorably with experiments. The model considers non-equilibrium evolution of vacancies that form due to differences in couplings between diffusing atoms and electron flows. This work is significant as the point defect evolution in 3DIC solder joints during electromigration has deep implications to the formation and coalescence of voids that ultimately compromise the structural and functional integrity of the joints.

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Section: Introductionmentioning

confidence: 89%

On the interfacial phase growth and vacancy evolution during accelerated electromigration in Cu/Sn/Cu microjoints

et al. 2018

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“…The second phase, wetting the grain boundaries, can be either liquid or solid [24,25]. The phenomena associated with the wetting of the GB by the second solid phase were observed in a variety of systems: aluminum-based alloys [26], titanium alloys [27], tungsten alloys [28], steels [29], superalloys [30], multicomponent alloys without the major component (so-called high-entropy one) [31], composites [32], welded and soldered joints [33]. The wetting of the GB by the second solid phase is called also GB spreading of a second solid phase.…”

Section: Introductionmentioning

confidence: 99%

Wetting of grain boundary triple junctions by intermetallic delta-phase in the Cu–In alloys

et al. 2021

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The paper studies the wetting of grain boundary triple junctions (GB TJs) by the second solid phase (intermetallic) d in the Cu-In alloys. In this system, the portion of grain boundaries in a copper-based solid solution (Cu), which are ''wetted'' by the second solid phase d, changes non-monotonically with increasing temperature. At first, the portion of such completely wetted GBs increases from zero to almost 100% when the sample is heated, and then quickly falls back to zero. The condition of complete wetting for the GB TJs (r GB [ 1.73 r SS ) is less stringent than for the GBs (r GB [ 2 r SS ). Therefore, if the transition from incomplete to complete wetting occurs with an increase in temperature, then all GB TJs should become completely wetted at a temperature T WTJ , lower than the temperature T WGB , at which all GBs become completely wetted. In this work on the Cu-In system, it was found experimentally for the first time that the wetting of the GB TJs also behaves non-monotonously. The percentage of wetted GB TJs also increases to 100% at first and then falls with increasing temperature. In this case, the portion of wetted GB TJs exceeds the portion of wetted GBs not only when it increases with increasing temperature, but also then, with the subsequent disappearance of fully wetted GBs.

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“…Comparatively, under the interconnected height less than dozens of micrometers, the IMCs account for a larger proportion in the interfacial region after soldering. Even, when the soldering time is extended, the solder can be consumed completely to form IMCs, leading to the formation of full IMCs joints (Chiu et al, 2014;Flötgen et al, 2014;Kato et al, 1999;Li and Chan, 2017;Li and Agyakwa, 2010;Li et al, 2011;Luu et al, 2013;Mo et al, 2015;Shao et al, 2016Shao et al, , 2017aShao et al, , 2017bTian et al, 2014a;Yao et al, 2017aYao et al, , 2017b. In other words, when the interconnected height is less than dozens of micrometers, the interfacial structure of joints can be transformed from substrates/IMCs/solder/IMCs/substrates to substrates/IMCs/substrates with the increase of soldering time.…”

Section: Introductionmentioning

confidence: 99%

“…Undoubtedly, it is very essential to conduct studies regarding the formation of full IMCs solder joints. Currently, relevant studies mainly focus on growth kinetics of IMCs layers during the formation of full IMCs joints (Li and Chan, 2017;Li and Agyakwa, 2010;Mo et al, 2015), soldering process and interfacial phase evolution for the formation of full IMCs joints (Chiu et al, 2014;Flötgen et al, 2014;Kato et al, 1999;Li et al, 2011;Luu et al, 2013;Shao et al, 2016;Yao et al, 2017aYao et al, , 2017b and reliabilities of full IMCs joints Shao et al, 2017aShao et al, , 2017bTian et al, 2014a). For the studies regarding interfacial phase evolution, these can be divided into two parts.…”

Section: Introductionmentioning

confidence: 99%

Morphology transformation on Cu₃Sn grains during the formation of full Cu₃Sn solder joints in electronic packaging

Yao

Jin

et al. 2018

SSMT

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Purpose This paper aims to analyze the morphology transformation on the Cu3Sn grains during the formation of full Cu3Sn solder joints in electronic packaging. Design/methodology/approach Because of the infeasibility of analyzing the morphology transformation intuitively, a novel equivalent method is used. The morphology transformation on the Cu3Sn grains, during the formation of full Cu3Sn solder joints, is regarded as equivalent to the morphology transformation on the Cu3Sn grains derived from the Cu/Sn structures with different Sn thickness. Findings During soldering, the Cu3Sn grains first grew in the fine equiaxial shape in a ripening process until the critical size. Under the critical size, the Cu3Sn grains were changed from the equiaxial shape to the columnar shape. Moreover, the columnar Cu3Sn grains could be divided into different clusters with different growth directions. With the proceeding of soldering, the columnar Cu3Sn grains continued to grow in a feather of the width growing at a greater extent than the length. With the growth of the columnar Cu3Sn grains, adjacent Cu3Sn grains, within each cluster, merged with each other. Next, the merged columnar Cu3Sn grains, within each cluster, continued to merge with each other. Finally, the columnar Cu3Sn grains, within each cluster, merged into one coarse columnar Cu3Sn grain with the formation of full Cu3Sn solder joints. The detailed mechanism, for the very interesting morphology transformation, has been proposed. Originality/value Few researchers focused on the morphology transformation of interfacial phases during the formation of full intermetallic compounds joints. To bridge the research gap, the morphology transformation on the Cu3Sn grains during the formation of full Cu3Sn solder joints has been studied for the first time.

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A study on interfacial phase evolution during Cu/Sn/Cu soldering with a micro interconnected height

Cited by 30 publications

References 57 publications

On the interfacial phase growth and vacancy evolution during accelerated electromigration in Cu/Sn/Cu microjoints

On the interfacial phase growth and vacancy evolution during accelerated electromigration in Cu/Sn/Cu microjoints

Wetting of grain boundary triple junctions by intermetallic delta-phase in the Cu–In alloys

Morphology transformation on Cu₃Sn grains during the formation of full Cu₃Sn solder joints in electronic packaging

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A study on interfacial phase evolution during Cu/Sn/Cu soldering with a micro interconnected height

Cited by 30 publications

References 57 publications

On the interfacial phase growth and vacancy evolution during accelerated electromigration in Cu/Sn/Cu microjoints

On the interfacial phase growth and vacancy evolution during accelerated electromigration in Cu/Sn/Cu microjoints

Wetting of grain boundary triple junctions by intermetallic delta-phase in the Cu–In alloys

Morphology transformation on Cu3Sn grains during the formation of full Cu3Sn solder joints in electronic packaging

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Morphology transformation on Cu₃Sn grains during the formation of full Cu₃Sn solder joints in electronic packaging