A study on fault detection for IC boards using thermography

Nishino, Seiji; Ohshima, Kenji

doi:10.1002/(sici)1520-684x(199805)29:5<49::aid-scj6>3.0.co;2-n

Syst. Comp. Jpn.

1998

DOI: 10.1002/(sici)1520-684x(199805)29:5<49::aid-scj6>3.0.co;2-n

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A study on fault detection for IC boards using thermography

Seiji Nishino

Kenji Ohshima

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A study on fault detection for IC boards using thermography

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