2021
DOI: 10.1177/14644207211013560
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A study on fabrication of silicon nitride-based advanced ceramic composite materials via spark plasma sintering

Abstract: The present study provides an overview of the fabrication of silicon nitride (Si3N4)-based advanced ceramic materials using spark plasma sintering. Being an excellent engineering ceramic material, silicon nitride is extensively being used in tribological components, aerospace, and automotive industries due to its unique blend of thermo-mechanical, tribological, and chemical properties. The selection of the sintering process, as well as sintering aids, strongly affects the properties of silicon nitride ceramics… Show more

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Cited by 4 publications
(3 citation statements)
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References 161 publications
(202 reference statements)
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“…Afterward, the external force makes the compacted powder shrink, reaching a high degree of densification. At this stage, the active mechanism is volume densification, grain boundary diffusion, and possibly dislocation climbing 44 . Figure 10B shows the material diffusion route between particles after the formation of the sintered neck.…”
Section: Resultsmentioning
confidence: 99%
See 1 more Smart Citation
“…Afterward, the external force makes the compacted powder shrink, reaching a high degree of densification. At this stage, the active mechanism is volume densification, grain boundary diffusion, and possibly dislocation climbing 44 . Figure 10B shows the material diffusion route between particles after the formation of the sintered neck.…”
Section: Resultsmentioning
confidence: 99%
“…At this stage, the active mechanism is volume densification, grain boundary diffusion, and possibly dislocation climbing. 44 Figure 10B shows the material diffusion route between particles after the formation of the sintered neck. When the diffusion is completed, the rearrangement reduces the interfacial energy between the particles, while the reduction of the pores between the particles reduces the total surface area and the free energy of the pore surface.…”
Section: Mechanism Analysis Of Spsmentioning
confidence: 99%
“…Si 3 N 4 is often used in the aerospace and military industry, mechanical engineering, communications, electronics, automotive, energy, chemical and biological fields. It is particularly promising for electronic packaging substrate applications, suitable for applications in complex and extreme environments [ 1 , 2 , 3 ].…”
Section: Introductionmentioning
confidence: 99%