A Study on Combination of ENEPIG Surface Finish and Solder Ball for Solder Joint Reliability

Gim, Geondu; Park, Jong-Min; Lim, Hun-Jung; Jung, Gookjin

doi:10.1109/eptc56328.2022.10013300

Cited by 1 publication

(4 citation statements)

References 29 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Consequently, they react with Ni, leading to the formation of various intermetallic compounds (IMCs) such as Ni 3 Sn 4 , Ni 3 Sn 2 , Ni 3 Sn, etc. [25,29,30]. This reaction consumes some Sn atoms in adjacent regions, consequently impeding the diffusion of Pb.…”

Section: Solderabilitymentioning

confidence: 99%

“…The analysis demonstrates that, at the high-temperature stage (150 °C) of the thermal shock tests, Sn diffusion accelerates. This leads to continuous growth and thickening of the intermetallic compound (IMC) layer at the connection interface [25,30]. Consequently, Before the temperature shock tests, a ductile fracture is observed within the solder balls, indicating significant plastic deformation during the shearing test but remaining attached to the solder pad.…”

Section: Reliability Testmentioning

confidence: 99%

“…The analysis demonstrates that, at the high-temperature stage (150 • C) of the thermal shock tests, Sn diffusion accelerates. This leads to continuous growth and thickening of the intermetallic compound (IMC) layer at the connection interface [25,30]. Consequently, the solder joint's strength is significantly weakened, causing a decrease in bonding strength.…”

Section: Reliability Testmentioning

confidence: 99%

“…Here, we address these challenges by focusing on the utilization of silver-based conductors and surface modification through the electroless plated Ni/Pd/Au (ENEPIG) process. Preliminary verification has been conducted for its application in BGA [25] and LGA [26] packaging on copper-clad substrates. The reasons behind the insufficient hermeticity of traditional LTCC fabrication processes are analyzed, and the hermeticity of thick film conductors with ENEPIG surface modification, as well as the wetting ability with Sn63Pb37 and An80Sn20 solders, are studied.…”

Section: Introductionmentioning

confidence: 99%

See 3 more Smart Citations

Research on Processability and Transmission Performance of Low Temperature Co-Fired Ceramic Ball Grid Array Packaging Based on Electroless Plating Surface Modification for Microwave Transceiver Circuits

Wang,

Hou,

Huo

et al. 2023

Materials

View full text Add to dashboard Cite

A microwave transmitter/receiver using the low-temperature co-fired ceramic substrate and ball grid array packaging demonstrates superior properties, including high integration, miniaturization, and high electromagnetic shielding. However, it holds limitations of inadequate hermeticity (that is, gas or moist impermeability), high cost, and low reproducibility. In this work, we aim to overcome these difficulties by introducing a new packing technique. The packaging utilizes an electroless plated Ni/Pd/Au surface, resulting in a significant enhancement of the packaging hermeticity by orders of magnitude, approaching the level of <5 × 10−9 Pa·m3/s. Both Sn63Pb37 and Au80Sn20 solder alloys demonstrate exceptional solderability, attributed to Pd atoms diffusing to the Au layer during soldering at 310 °C. A reliability test of the packaging shows that the shear strength of the solder balls drops after thermal shocks but negligibly affects the hermeticity of the packaging. Furthermore, a meticulously designed internal vertical interconnect structure and I/O interconnections were engineered in the ball grid array packaging, showcasing excellent transmission characteristics within the 10–40 GHz frequency range while ensuring effective isolation between ports.

show abstract

Section: Solderabilitymentioning

confidence: 99%

Section: Reliability Testmentioning

confidence: 99%

Section: Reliability Testmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations