A Study of Zn-Ferrite Core Planar Power Inductor Embedded in Organic Interposer for Power Supply integrated in LSI Package

Kobayashi, Hiroki; Sato, F.; Hagita, K.; Takeda, Ryo; Sonehara, Makoto; Sato, Toshiro; Matsushita, Nobuhiro; Kobayashi, Kazuyoshi; Shimizu, Hiroshi; Fujii, Tatsuzo; Ishida, Koichi; Sakurai, Takayasu

doi:10.3379/msjmag.1305r012

Cited by 3 publications

(3 citation statements)

References 2 publications

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“…A static magnetization of the Zn-Ferrite film is measured with the vibrating sample magnetometer system (VSM, BHV-55: Rika Denshi Co., Ltd.) is shown in Fig. 9 [8].…”

Section: The Measurement Results Of Characteristicsmentioning

confidence: 99%

Planar Power Inductor with Magnetic Film for Embedded LSI Package

Fujii

Kobayashi

Shimizu

et al. 2012

International Symposium on Microelectronics

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A power inductor component is relatively very thick and large shape. Therefore, these components are not appropriate feature to be embedded into a LSI package and mounted nearby a LSI chip, it is challengeable to make the embedded application. However, LSI power delivery system is going for low voltage and large current, and losses between power supply and loads impacts on the power supply efficiency characteristic. In order to solve this problem, miniaturization for a power inductor is needed to realize the embedded applications. As one of approaches to realize the power delivery systems, the planar power inductor with Zn-Ferrite film has been studied for the next generations. A structure of planar power inductor was designed to be configured 2-turn inner copper spiral coil covered with top and bottom magnetic core. The Zn-Ferrite film used as a magnetic core has a high resonance frequency around 300MHz and high saturation magnetization of 0.6T or more, and this film can be formed in low temperature, which can be handled in parallel way to fabricate an organic package. We have developed the organic package with employing the power inductors covered with Zn-Ferrite as prototype of the embedded application, and evaluated the electrical and magnetic characterizations. The thickness of embedded planar power inductor covered with Zn-ferrite film is 50um, and the size is 850um squares. Q factor is 10 to 13 in 30MHz to 100MHz. The degradation of inductance caused by the superimposed current does not happen without changing until 3A.

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“…A static magnetization of the Zn-Ferrite film is measured with the vibrating sample magnetometer system (VSM, BHV-55: Rika Denshi Co., Ltd.) is shown in Fig. 9 [8].…”

Section: The Measurement Results Of Characteristicsmentioning

confidence: 99%

Planar Power Inductor with Magnetic Film for Embedded LSI Package

Fujii

Kobayashi

Shimizu

et al. 2012

International Symposium on Microelectronics

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“…When the inductor current is a triangular wave, the amplitude of the ripple current is expressed by Eq. (1).…”

Section: Influence Of Surface Wiring Pattern Formed Above the Power Imentioning

confidence: 99%

Integrated CMOS Switch Buck DC-DC Converter Fabricated in Organic Interposer with Embedded Magnetic Core Inductor

et al. 2019

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In this paper, the development of a CMOS switch buck DC-DC converter fabricated in an organic interposer with an embedded power inductor is described. The power inductor is fabricated by using a magnetic core made of an Fe-based amorphous alloy powder-filler/epoxy composite sheet to form a fully closed magnetic circuit and is embedded in the organic interposer in a lamination process. The fabricated power inductor is located under a CMOS control chip and has a of 3.5-mm-square footprint. The CMOS switch buck DC-DC converter runs at 20 MHz, and the fabricated power inductor has an inductance of 150 nH and Q-factor of 38 at around 20 MHz. Furthermore, the influence of magnetic flux leakage from the embedded power inductor to a copper wiring pattern on the surface was analyzed in a simulation that utilized three-dimensional electromagnetic field analysis software (ANSYS; HFSS). Based on the simulation result, the conduction losses of the inductor were calculated under the assumption of use in a synchronous buck converter operating with a 5-V input and 3.3-V 0.8-A output.

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“…Therefore, the RF circuits and devices must be smaller and thinner. [6][7][8][9][10][11][12][13][14][15][16][17][18][19][20][21][22][23][24] RF circuits are generally differential input=output circuits that need the common-mode filter (CMF) in order to reduce the common-mode noise generated by unbalance signals. 1,25) The CMF is a common chip device, 26) and its miniaturization is also important in the future.…”

Section: Introductionmentioning

confidence: 99%

Fabrication and evaluation of dispersed-Ag nanoparticles-in-polyimide thin films

Sonehara¹,

Watanabe²,

Yamaguchi³

et al. 2017

Jpn. J. Appl. Phys.

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A thin-film common-mode filter (TF-CMF) for cell phones in the UHF band was fabricated and evaluated. The TF-CMF consisted of multiple metal–insulator–metal (MIM) capacitors and inductors. The sizes of the 0.70–1.0 GHz band-type and 1.8–2.0 GHz band-type TF-CMFs are 1,140 × 1,260 × 10.5 µm3, and 1,060 × 1,060 × 10.5 µm3, respectively. The footprint in both types of TF-CMFs is over 1 mm2. In order to miniaturize the TF-CMF, we proposed to change a polyimide-only to a polyimide with dispersed Ag nanoparticles with high permittivity in the insulator layer for the MIM capacitor of the TF-CMF. A polyimide () thin film with dispersed high-density Ag nanoparticles has a relative permittivity of about 8, which is twice as high as that of the polyimide-only thin film. If the capacitance and distance between electrodes are the same, then the capacitor footprint may be halved.

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A Study of Zn-Ferrite Core Planar Power Inductor Embedded in Organic Interposer for Power Supply integrated in LSI Package

Cited by 3 publications

References 2 publications

Planar Power Inductor with Magnetic Film for Embedded LSI Package

Planar Power Inductor with Magnetic Film for Embedded LSI Package

Integrated CMOS Switch Buck DC-DC Converter Fabricated in Organic Interposer with Embedded Magnetic Core Inductor

Fabrication and evaluation of dispersed-Ag nanoparticles-in-polyimide thin films

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