A study of through package vias in a glass interposer for multifunctional and miniaturized systems

Amrani, Abderrahim El; Benali, A.; Bouya, Mohsine; Faqir, Mustapha; Demir, Kaya; Hadjoudja, Abdelkader; Ghogho, Mounir

doi:10.1016/j.microrel.2014.07.108

Cited by 16 publications

(7 citation statements)

References 8 publications

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“…Accordingly, the interposer architecture is demonstrated with silicon (Si) and a glass material system for the performance requirement of ultrafine pitch features. Glass-based interposers have been regarded as a superior alternative to Si-based interposer architecture because of their thermal and electrical properties and low cost [ 1 , 2 ]. Glass interposers are targeted to reduce the cost of high-density integration and compatibility with the large pan size (450–700 mm) procedure [ 1 ].…”

Section: Introductionmentioning

confidence: 99%

Layout Dependence Stress Investigation in through Glass via Interposer Architecture Using a Submodeling Simulation Technique and a Factorial Design Approach

et al. 2023

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The multi-chiplet technique is expected to be a promising solution to achieve high-density system integration with low power consumption and high usage ratio. This technique can be integrated with a glass interposer to accomplish a competitive low fabrication cost compared with the silicon-based interposer architecture. In this study, process-oriented stress simulation is performed by the element activation and deactivation technique in finite element analysis architecture. The submodeling technique is also utilized to mostly conquer the scale mismatch and difficulty in mesh gridding design. It is also used to analyze the thermomechanical responses of glass interposers with chiplet arrangements and capped epoxy molding compounds (EMC) during curing. A three-factor, three-level full factorial design is applied using the analysis of variance method to explore the significance of various structural design parameters for stress generation. Analytic results reveal that the maximum first principal stresses of 130.75 and 17.18 MPa are introduced on the sidewall of Cu-filled via and the bottom of the glass interposer, respectively. Moreover, the EMC thickness and through glass via pitch are the dominant factors in the adopted vehicle. They significantly influence the stress magnitude during heating and cooling.

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Section: Introductionmentioning

confidence: 99%

Layout Dependence Stress Investigation in through Glass via Interposer Architecture Using a Submodeling Simulation Technique and a Factorial Design Approach

et al. 2023

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“…Glass has relative superior electrical properties, a manageable coefficient of thermal expansion (CTE), low fabrication process cost, and prospective compatibility with next-generation panel fabrication processes [ 1 , 2 , 3 ]. Accordingly, glass-based interposers are regarded as the most promising material to replace the Si-based interposer technique; substantial literature has demonstrated the related technology, including the fabrication, thermal treatment, and metallization processes [ 4 , 5 , 6 , 7 , 8 ]. The embedded integrated circuit architecture with glass interposer has been demonstrated to meet the requirement of fine line/space and high-density interconnections [ 9 ].…”

Section: Introductionmentioning

confidence: 99%

Reliability Assessment of Thermocompressed Epoxy Molding Compound through Glass via Interposer Architecture by the Submodeling Simulation Approach

et al. 2022

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In glass interposer architecture and its assembly process, the mechanical responses of interposer structure under thermocompression process-induced thermal loading and generated shrinkage of molding material are regarded as a major reliability issue. Thousands of metal-filled via are involved in glass interposers and are regarded as a potential risk that can lead to cracking and the failure of an entire vehicle. In this study, a finite element-based submodeling approach is demonstrated to overcome the complexity of modeling and the relevant convergence issue of interposer architecture. Convergence analysis results revealed that at least four via pitch-wide regions of a local simulation model were needed to obtain the stable results enabled by the submodeling simulation approach. The stress-generation mechanism during thermocompression, the coefficient of thermal expansion mismatch, and the curing process-induced shrinkage were separately investigated. The critical stress location was explored as the outer corner of the chip, and the maximum first principal stress during the thermocompression process generated on the chip and glass interposer were 34 and 120 MPa, respectively.

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“…In addition, some of challenges associated with the fabrication of glass interposers still exist, for instance, formation and metallization of TGV, compatibility issues relating to 2.5D/3D RF integration based on TGV interposer. The common fabrication methods for vias on glass substrates include wet etching, deep reactive-ion etching, sandblasting, laser ablation, the use of photosensitive glass, and the glass reflow process [13][14][15][16][17][18][19][20]. TGVs with 100 µm pitch and high aspect ratio are formed using a method called focused electrical discharging method in thick glass substrates, the method has achieved high throughput [14].…”

Section: Introductionmentioning

confidence: 99%

“…TGVs with 100 µm pitch and high aspect ratio are formed using a method called focused electrical discharging method in thick glass substrates, the method has achieved high throughput [14]. Studies have reported a pitch of 30 µm and a height of less than 200 µm for a TGV sample fabricated by laser drilling [1,[17][18][19][20]. A novel photosensitive glass, patterned by photolithography and followed by wet chemical etching process is reported, the TGVs with a diameter of 20 µm and a 4:1 aspect ratio is demonstrated [18].…”

Section: Introductionmentioning

confidence: 99%

Design, fabrication, and radio frequency property evaluation of a through-glass-via interposer for 2.5D radio frequency integration

Cai

Yan

et al. 2019

J. Micromech. Microeng.

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In this paper, a through-glass-via (TGV) interposer for 2.5D radio frequency (RF) integration is presented. A coplanar waveguide (CPW) transmission line with grounded TGVs on one side interconnects with the mounted RF devices, and an electrical ground plane on the other side. Tapered TGVs are fabricated using a combined method of sandblasting and thinning/polishing process to achieve precise control of the profile of the vias and improve uniformity. The TGVs are metalized by conformal copper (Cu) electroplating to form a vertical interconnection between the upper and lower metal layers, which can maintain RF performance and avoid thermal stress issues. The CPW transmission lines with electrically grounded TGVs and test structures are designed, fabricated and tested to evaluate the TGV's RF performance and suitability for 2.5D RF integration. The RF measurements show that the insertion loss is about 0.13 dB mm −1 @10 GHz for the CPW line with grounded TGV which is less than 0.1 dB@10 GHz for a single TGV. We analyzed S parameter for the tests and simulations when taking into account various factors in the manufacturing process, such as the surface roughness and metal resistivity. The results provide a research direction for the optimization of the parameters in the follow-up study. In addition, a 2.5D RF receiver module based on the proposed TGV interposer in the L-band is assembled and validated. The gain value of the TGV interposer integrated RF module is about 14.4 dB, which is close to the theoretical value.

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A study of through package vias in a glass interposer for multifunctional and miniaturized systems

Cited by 16 publications

References 8 publications

Layout Dependence Stress Investigation in through Glass via Interposer Architecture Using a Submodeling Simulation Technique and a Factorial Design Approach

Layout Dependence Stress Investigation in through Glass via Interposer Architecture Using a Submodeling Simulation Technique and a Factorial Design Approach

Reliability Assessment of Thermocompressed Epoxy Molding Compound through Glass via Interposer Architecture by the Submodeling Simulation Approach

Design, fabrication, and radio frequency property evaluation of a through-glass-via interposer for 2.5D radio frequency integration

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