A Study of the Effect of Nanosized Particles on Transient Liquid Phase Diffusion Bonding Al6061 Metal–Matrix Composite (MMC) Using Ni/Al2O3 Nanocomposite Interlayer

Cooke, Kavian O.

doi:10.1007/s11663-012-9643-5

Cited by 20 publications

(18 citation statements)

References 16 publications

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“…Unfortunately, the persistent formation of a continuous layer of intermetallic compounds at the joint interface limits the potential applications of solid-state diffusion bonding. Recent studies on the transient liquid phase diffusion (TLP) bonding of dissimilar alloys [11,14] have shown that the addition of nanoparticles to the interlayer has the capacity to constrain the size of the intermetallic compounds that form at the interface while disrupting the shape of the intermetallic layer. In these studies, the results show that when nanoparticles were added to the interlayer, the intermetallic compounds that formed at the interface were shorter and more disperse within the joint region [11].…”

Section: Introductionmentioning

confidence: 99%

High-Temperature Diffusion Bonding of Ti–6Al–4V and Super-Duplex Stainless Steel Using a Cu Interlayer Embedded with Alumina Nanoparticles

Cooke

Richardson

Khan

et al. 2020

JMMP

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In this study, Ti–6Al–4V alloy was diffusion bonded to super-duplex stainless steel (SDSS) using an electrodeposited Cu interlayer containing alumina nanoparticles to determine the effects of bonding parameters on the microstructural evolution within the joint region. The results of the study showed that the homogeneity of the joint is affected by the bonding time and bonding temperature. The results also showed that when a Cu/Al2O3 interlayer is used, Ti–6Al–4V alloy can be successfully diffusion bonded to SDSS at temperatures above 850 °C. The combination of longer bonding time and high bonding temperature leads to the formation of various intermetallic compounds within the interface. However, the presence of the Al2O3 nanoparticles within the interface causes a change in the volume, size, and shape of the intermetallic compounds formed by pinning grain boundaries and restricting grain growth of the interlayer. The variation of the chemical composition and hardness across the bond interface confirmed a better distribution of hard phases within the joint center when a Cu/Al2O3 interlayer was used.

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Section: Introductionmentioning

confidence: 99%

High-Temperature Diffusion Bonding of Ti–6Al–4V and Super-Duplex Stainless Steel Using a Cu Interlayer Embedded with Alumina Nanoparticles

Cooke

Richardson

Khan

et al. 2020

JMMP

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“…A high resolution SEM micrograph shown in Figure 5 revealed the presence of a nano-sized alumina particle at the center of a grain. EDX spectra of the particle showed Al and O in high concentrations with traces of Mg [23,24,33]. Comparing Gibbs free energy of formation at the bonding temperature for MgO (-1195 kJ/mol) and Al2O3 (-985 kJ/mol) it is found that Al2O3 is unstable in the presence of Mg hence it is like that some of the nano-size Al2O3 will decomposed to form MgAl2O4 compound.…”

Section: Advanced Aspects Of Spectroscopy 318mentioning

confidence: 96%

“…A number of coating parameters were studied to determine the effect of each on the coating thickness: pH of the electrolyte, current density, electrolyte temperature, agitation frequency and deposition time [33]. Samples were coated for time intervals of 2, 4, 6, 8, 10, 15, 20 and 30 minutes.…”

Section: Electrodeposition Of the Nano-composite Ni/al2o3 Coatingmentioning

confidence: 99%

“…The particles were thoroughly mixed into the solution for two hours and kept in suspension in the bath with a magnetic stirrer rotating at 300 rpm. The coating solution was maintained at a temperature of 50 o C and pH of 3.0 [33]. The thickness of Ni-Al2O3p coatings were controlled by the current density and plating time.…”

Section: Electrodeposition Of the Nano-composite Ni/al2o3 Coatingmentioning

confidence: 99%

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Spectroscopic Analyses of Nano-Dispersion Strengthened Transient Liquid Phase Bonds

Cooke¹

2012

Advanced Aspects of Spectroscopy

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“…Aluminum matrix composites (AMCs) reinforced with particulates have a combination of superior properties, e.g., light weight, high stiffness, high wear resistance and high specific strength. Numerous methods have been utilized to manufacture particle reinforced AMCs, for instance, diffusion bonding 1,2 , compo-casting 3,4 and powder metallurgy 5,6 . Powder metallurgy is especially applicable because its processing temperature is relatively low and particle reinforcements can be uniformly dispersed.…”

Section: Introductionmentioning

confidence: 99%

Solution Treatment Behaviors of 6061 Aluminum Alloy Prepared by Powder Thixoforming

Zhang

Chen

2018

Mat. Res.

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Powder thixoforming (PTF) was a promising processing technology that can be used to fabricate high strength particle reinforced aluminum matrix composites, and a pioneer 6061 matrix alloy was fabricated utilizing PTF to investigate its solution treatment behaviors. A comparison study with traditional permanent mold cast (PMC) 6061 alloy disclosed that PTF alloy showed significantly reduced pore amount with only 0.16% (3.50% for PMC alloy). During solution treatment, PTF alloy displayed a much quicker solutionization progress than PMC alloy because of coarse eutectic phases and primary dendrites in latter alloy, its peak values of 14.5%, 241 MPa and 195 MPa in elongation, ultimate tensile strength and yield strength were achieved at 560ºC, an enhancement of 81.3%, 33.9% and 97.0%, respectively, compared with as-fabricated alloy. The dissolution of eutectic phases plays a dominative role in the growth of the primary α phases and secondarily primary α phases within 535ºC. However, the coarsening after 535ºC is subject to a mixture model involving atom diffusion along grain boundaries and through the crystal lattice. The superior tensile strengths of PTF alloy than PMC alloy resulted from decreased grain size, enhanced solid solution strengthening, reduced porosities and decreased harmful effect of insoluble phases in PTF alloy.

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A Study of the Effect of Nanosized Particles on Transient Liquid Phase Diffusion Bonding Al6061 Metal–Matrix Composite (MMC) Using Ni/Al2O3 Nanocomposite Interlayer

Cited by 20 publications

References 16 publications

High-Temperature Diffusion Bonding of Ti–6Al–4V and Super-Duplex Stainless Steel Using a Cu Interlayer Embedded with Alumina Nanoparticles

High-Temperature Diffusion Bonding of Ti–6Al–4V and Super-Duplex Stainless Steel Using a Cu Interlayer Embedded with Alumina Nanoparticles

Spectroscopic Analyses of Nano-Dispersion Strengthened Transient Liquid Phase Bonds

Solution Treatment Behaviors of 6061 Aluminum Alloy Prepared by Powder Thixoforming

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