2019 IEEE 69th Electronic Components and Technology Conference (ECTC) 2019
DOI: 10.1109/ectc.2019.00175
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A Study of Substrate Models and Its Effect On Package Warpage Prediction

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Cited by 18 publications
(4 citation statements)
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“…Even though the boundary conditions were different from the real condition and the tests were performed in room conditions for the test structure, we expected that the results from the experiment would provide precise knowledge of the thermomechanical responses of the bidirectionally corrugated core sandwich structures before they would be employed in the TPS panel. In this thermomechanical test, the thermal deformation of the test structure was measured using a three-dimensional digital image correlation (DIC) method, which is a non-contact, full-field deformation measurement method and has been considered to be a highly accurate method in various fields of research, such as for large deformation [43,44], high-temperature structures [45][46][47], and small structures [48][49][50][51][52]. The inner surface of the test structure was painted with a white background and black dots known as a speckle pattern.…”
Section: Thermomechanical Testing and Validationmentioning
confidence: 99%
“…Even though the boundary conditions were different from the real condition and the tests were performed in room conditions for the test structure, we expected that the results from the experiment would provide precise knowledge of the thermomechanical responses of the bidirectionally corrugated core sandwich structures before they would be employed in the TPS panel. In this thermomechanical test, the thermal deformation of the test structure was measured using a three-dimensional digital image correlation (DIC) method, which is a non-contact, full-field deformation measurement method and has been considered to be a highly accurate method in various fields of research, such as for large deformation [43,44], high-temperature structures [45][46][47], and small structures [48][49][50][51][52]. The inner surface of the test structure was painted with a white background and black dots known as a speckle pattern.…”
Section: Thermomechanical Testing and Validationmentioning
confidence: 99%
“…As a result, RDLs in advanced packages become extremely complex in shape and behavior, posing great challenges in accurately capturing their thermo-mechanical characteristics. Additionally, in advanced packages, substrate is extremely thinned to several microns or even sub-microns [ 16 ] which are similar to or even thinner than RDL, making the RDLs more prominent compared to other package components [ 17 , 18 ]. For this reason, RDLs are playing crucial roles in package thermo-mechanical characteristics.…”
Section: Introductionmentioning
confidence: 99%
“…Additionally, in advanced packages, substrate is extremely thinned to several microns or even sub-microns [16] which are similar to or even thinner than RDL, making the RDLs more prominent compared to other package components [17,18]. For this reason, RDLs are playing crucial roles in package thermo-mechanical characteristics.…”
Section: Introductionmentioning
confidence: 99%
“…By tracking movements of exterior features of a structure that appear on digital images captured by cameras, the displacement can be calculated by photogrammetry theory and its modal parameters can be estimated for damage detection. The digital image correlation (DIC) method is a kind of photogrammetry method that measures the full-field deformation of structure in various fields of research, such as for vibration [ 44 ], crack monitoring [ 45 , 46 , 47 ], high-temperature structures [ 48 , 49 , 50 ], electronic packaging [ 51 , 52 , 53 ], and small structures [ 54 , 55 ]. The identification of a whole area displacement field or operating deflection shape (ODS) is one of the most interesting features using the DIC method [ 56 ].…”
Section: Introductionmentioning
confidence: 99%