A Study of Pattern Density and Process Variations Impact on the Reliability Performance of Multi-Level Capacitance Structure in Low-k Copper Interconnects

Chen, Qian; Xie, Lanfei; Chockalingam, Ramasamy; Eng, C. W.; Katakamsetty, Ushasree; Li, Pinghui; Chen, Li Han; Guan, Xiaochong; Tan, Soon Yoeng; Tan, Juan Boon

doi:10.1109/ipfa.2018.8452535

2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) 2018

DOI: 10.1109/ipfa.2018.8452535

|View full text |Cite

A Study of Pattern Density and Process Variations Impact on the Reliability Performance of Multi-Level Capacitance Structure in Low-k Copper Interconnects

Qian Chen

Lanfei Xie

Ramasamy Chockalingam

et al.

Help me understand this report

This publication either has no citations yet, or we are still processing them

Set email alert for when this publication receives citations?

See others like this or search for similar articles

scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.

Contact Info

hi@scite.ai

10624 S. Eastern Ave., Ste. A-614

Henderson, NV 89052, USA

Blog Terms and Conditions API Terms Privacy Policy Contact Cookie Preferences Do Not Sell or Share My Personal Information

Made with 💙 for researchers

Part of the Research Solutions Family.

A Study of Pattern Density and Process Variations Impact on the Reliability Performance of Multi-Level Capacitance Structure in Low-k Copper Interconnects

This publication either has no citations yet, or we are still processing them

See others like this or search for similar articles

Contact Info

Product

Resources

About