1979
DOI: 10.1007/bf00620584
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A study of electrochemical kinetics of copper deposition under pulsed current conditions

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Cited by 21 publications
(8 citation statements)
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“…For the exchange current density i o , appreciable values are obtained in accordance with literature data reported by Farndon et al [ 38 ] and Wan et al [ 39 ]. The addition of CZ in the electrolyte solution leads to a small diminution of the exchange current density, which demonstrates the slight inhibitory effect of the organic compound on copper electrodeposition.…”
Section: Resultssupporting
confidence: 91%
“…For the exchange current density i o , appreciable values are obtained in accordance with literature data reported by Farndon et al [ 38 ] and Wan et al [ 39 ]. The addition of CZ in the electrolyte solution leads to a small diminution of the exchange current density, which demonstrates the slight inhibitory effect of the organic compound on copper electrodeposition.…”
Section: Resultssupporting
confidence: 91%
“…These are believed to correspond to the homogeneous solid-state reduction of proton insertion into the channels of ramsdellite and pyrolusite domains of ␥-MnO 2 . Continuing the potential sweep to more negative values than −0.4 V causes the formation of a solution-based Mn(III) intermediate via dissolution of MnOOH to subsequently precipitation of pyrochroite Mn(OH) 2 [39]. For ␥-MnO 2 samples, the higher capacity of this process is usually associated with higher surface area and hence dissolution of the starting material.…”
Section: Cyclic Voltammetrymentioning
confidence: 97%
“…This surface is then oxidized to provide a highly antireflective surface [264]. Wan et al [265] reported that pulse time exerted the greatest effect on current efficiency, and Popov et al [266] showed that the effective current density is dependent not only on values of the effective overpotential but also on the ratio of pulse-to-pause duration and on the frequency of the input pulsating potential. Rudder [267] compared pulse plating of acid copper against cyanide copper and found that the leveling and thickness performance of the pulse-plated cyanide copper was better than that of acid copper.…”
Section: Current Modulation Techniquesmentioning
confidence: 99%