A Study of Dispense Needle for Die Attach Voids Mitigation

Rodriguez, Rennier S.; Bacquian, Bryan Christian S.; Gomez, Frederick Ray I.; Graycochea, Edwin M.

doi:10.9734/jerr/2020/v14i117114

Cited by 6 publications

(4 citation statements)

References 1 publication

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“…Other microscopy techniques such as the scanning electron microscopy (SEM) could be used for better view of voids images. Lastly, discussions and learnings shared in [8][9][10] are helpful to improve the assembly processes particularly the die attach process.…”

Section: Conclusion and Recommenda-tionsmentioning

confidence: 99%

Glue Voids Reduction on QFN Device through Material and Process Improvement

Graycochea¹,

Manalo²,

Rodriguez³

et al. 2021

JERR

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The paper is focused on the glue voids reduction on critical semiconductor quad-flat no-leads (QFN) device processed on a stencil printing type of die attach machine. Process optimization through material preparation improvement was done to mitigate the silver lumps of the sintering glue which is a main contributor on the voids occurrence. Eventually, the glue voids were reduced to less than the allowed 5% limit. For future works, the learnings and configuration could be used on devices with similar requirement.

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Section: Conclusion and Recommenda-tionsmentioning

confidence: 99%

Glue Voids Reduction on QFN Device through Material and Process Improvement

Graycochea¹,

Manalo²,

Rodriguez³

et al. 2021

JERR

View full text Add to dashboard Cite

show abstract

“…For future works, Machine B could be used for such devices with tight die placement requirement. With regards to the die attach assembly process robustness and optimization, works and learnings shared in [8][9][10][11][12] are really helpful.…”

Section: Conclusion and Recommend-ationsmentioning

confidence: 99%

Die Placement Performance Evaluation on Different Machine Platforms

Rodriguez¹,

Graycochea²,

Gomez³

2021

JERR

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The paper focuses on the die placement tolerance capability with critical design for land grid array (LGA) device evaluated on two different die attach machine platforms. The evaluation was narrowed down into two main die attach machines with the objective of attaining the best performance in terms of die placement tolerance capability. Die placement tolerance were quantified and only die attach Machine B was able to satisfy the specification of less than 30 microns. The study used a bar graph comparison in terms of die placement tolerance on the two machines and presented the effect of machine selection on die placement tolerance capability. For future works, the selected die attach machine could be used for devices with critical requirement.

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“…Based on the study, Machine B platform and its configuration could be used as a reference in handling QFN packages with critical requirement at die attach assembly process. Works and learnings shared in [1,[9][10][11] are helpful to improve the assembly processes particularly the die attach process. Die attach machines could also be evaluated based on the reliability performance of the device.…”

Section: Recommendationsmentioning

confidence: 99%

Die Attach Machine Selection for Glue Voids Reduction Performance

Graycochea¹,

Rodriguez²,

Gomez³

et al. 2020

JERR

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The paper is focused on the glue voids reduction of quad-flat no-leads (QFN) devices evaluated on different die attach machine platforms. The evaluation was narrowed-down into two main die attach machines with the objective of attaining the best performance in terms of reducing or eliminating the glue voids. Glue voids were quantified and only die attach Machine B was able to satisfy the specification. The study used analysis of variance on the two machines and presented the effect of machine selection on glue voids reduction. For future works, the selected die attach machine could be used for devices with critical requirement.

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A Study of Dispense Needle for Die Attach Voids Mitigation

Cited by 6 publications

References 1 publication

Glue Voids Reduction on QFN Device through Material and Process Improvement

Glue Voids Reduction on QFN Device through Material and Process Improvement

Die Placement Performance Evaluation on Different Machine Platforms

Die Attach Machine Selection for Glue Voids Reduction Performance

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