A study of annealing stages in commercial pure Cu using mechanical measurements and positron annihilation lifetime technique

Bishay, I. K.; Aly, Emad H.; Saadallah, Fardous

doi:10.1016/j.msea.2010.02.074

Cited by 5 publications

(2 citation statements)

References 19 publications

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“…Moreover, Kuo et al 26) and Bishary et al 27) reported that Q = 50 kJ/mol for dislocation annihilation through cross slip at T < 0.4 T m from results of static recovery tests.…”

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confidence: 99%

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Creep Mechanism in Several Grades of Aluminum at Low Temperatures

Matsunaga

Satô

2013

Mater. Trans.

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Creep tests were performed at less than 0.4 T m (T m is the melting temperature) for 99.999, 99.57 and 99.52% aluminum with several grain sizes in the range of 50330 µm. These Al materials show remarkable creep behavior with an apparent activation energy (Q) of 30 kJ/mol, a stress exponent of 4, and a grain-size exponent of zero, and with a larger creep rate with increasing purity. These parameters resemble those of conventional dislocation creep, which is rate-controlled by the usual diffusion processes, except for the extra-low Q value. This means that a non-diffusional process affects the steady state deformation in this temperature region. Transmission electron microscopy revealed the development of a cell structure in the steady state and dislocations without any tangles in the cell interiors. Therefore, because the ratecontrolling process could not occur inside of the cells, dislocation annihilation occurred through cross slip around the cell walls. According to these creep parameters and microstructural observations, the observed creep region is suggested to be a new creep region occurring through a non-diffusional process within the existing deformation mechanism map of Al at less than 0.4 T m .

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“…Moreover, Kuo et al 26) and Bishary et al 27) reported that Q = 50 kJ/mol for dislocation annihilation through cross slip at T < 0.4 T m from results of static recovery tests.…”

Section: )mentioning

confidence: 99%

“…26,27) Vegge et al 24) and Pendurti et al 25) evaluated the Q value of the phenomenon in copper (Cu) by performing molecular dynamics (MD) simulations using the conventional FriedelEscaig cross-slip model.…”

Section: )mentioning

confidence: 99%

Creep Mechanism in Several Grades of Aluminum at Low Temperatures

Matsunaga

Satô

2013

Mater. Trans.

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High-heat flux Cu-0.8Y alloys investigated by positron annihilation spectroscopy

Domínguez‐Reyes

Monge

Galiana

et al. 2022

Journal of Alloys and Compounds

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The Evolution of Defects in Deformed Cu-Ni-Si Alloys during Isochronal Annealing Studied by Positron Annihilation

Qi¹,

Jia²,

Liu³

et al. 2012

Chinese Phys. Lett.

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The effect of isochronal annealing on the deformation-induced defects in pure Cu and Cu-Ni-Si alloys is studied by positron annihilation spectroscopy. For the cold-rolled Cu, annealing up to 900°C causes a gradual recovery of the deformation-induced defects and monotonous decrease of the hardness. This indicates that its hardening is mainly related with defects such as dislocations. However, for the hot-rolled and quenched Cu-Ni-Si alloy, although there is a partial recovery of defects after annealing below 500°C, formation of additional defects is observed after annealing above 500°C. The hardness of Cu-Ni-Si alloy has a maximum value after annealing at 500°C, which suggests that the hardening of Cu-Ni-Si alloy is not due to defects, but primarily due to the precipitation formed during annealing. Further annealing of the Cu-Ni-Si alloy above 500°C results in over-aging effect and the precipitates lose coherence with the host matrix, which leads to positron trapping by vacancy clusters in the incoherent interface region.

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A study of annealing stages in commercial pure Cu using mechanical measurements and positron annihilation lifetime technique

Cited by 5 publications

References 19 publications

Creep Mechanism in Several Grades of Aluminum at Low Temperatures

Creep Mechanism in Several Grades of Aluminum at Low Temperatures

High-heat flux Cu-0.8Y alloys investigated by positron annihilation spectroscopy

The Evolution of Defects in Deformed Cu-Ni-Si Alloys during Isochronal Annealing Studied by Positron Annihilation

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