2021
DOI: 10.1007/s12633-021-01352-5
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A Study of an Ultrasensitive Label Free Silicon Nanowire FET Biosensor for Cardiac Troponin I Detection

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Cited by 31 publications
(7 citation statements)
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“…A variety of cTnI biosensors based on optical, electrochemical and electrical transduction have been reported, 54 among which nanowire-based FET biosensors have shown LoD values typically ranging from 100 pg mL −1 down to 1 pg mL −1 . [55][56][57][58] Yet, the discussed GFET approach based on the use of optimized pyrene-based functionalization has a comparable high sensitivity to cTnI sensing, with the additional advantage of using considerably simpler fabrication processes, without the need of harsh and complex chemistry methods for the functionalization of the sensing area.…”
Section: Graphene Modification With Pmal For Sensing Of Ctnimentioning
confidence: 99%
“…A variety of cTnI biosensors based on optical, electrochemical and electrical transduction have been reported, 54 among which nanowire-based FET biosensors have shown LoD values typically ranging from 100 pg mL −1 down to 1 pg mL −1 . [55][56][57][58] Yet, the discussed GFET approach based on the use of optimized pyrene-based functionalization has a comparable high sensitivity to cTnI sensing, with the additional advantage of using considerably simpler fabrication processes, without the need of harsh and complex chemistry methods for the functionalization of the sensing area.…”
Section: Graphene Modification With Pmal For Sensing Of Ctnimentioning
confidence: 99%
“…Energy detectors [16][17][18][19][20], waveform or matched filter-based detectors [16,18,21,22], cyclostationarity-based detectors [23][24][25][26][27], and wavelet and time-frequency based detectors [28][29][30], to name a few, have all been modified for the implementation of spectrum sensing for cognitive radio. Also, many researchers used many device level measurement spectrum sensing [31][32][33][34][35][36][37].…”
Section: Related Workmentioning
confidence: 99%
“…The issue is whether businesses maintain ICT infrastructure, hardware, software, information system, and people and human resource readiness with their business [17][18][19][20]. Now, even large businesses, such as those in the semiconductor industry, are adopting newer technologies, such as three-dimensional IC integration employing Cu-Cu bonding [21][22][23][24][25][26][27][28], various revolutionary nanometer-level device fabrication techniques, even bio devices, and wearable antennas [29][30][31][32][33][34][35]. The framework model for the relationships among the ICT readiness dimensions, including ICT infrastructure, ICT hardware software, information system, and people and human resource, is shown in Figure 1.…”
Section: Introductionmentioning
confidence: 99%