A Study of Advancing Ultralow-Power 3D Integrated Circuits with TEI-LP Technology and AI-Enhanced PID Autotuning
Sangmin Jeon,
Hyunseok Kwak,
Woojoo Lee
Abstract:The 3D integrated circuit (3D-IC) is garnering significant attention from academia and industry as a key technology leading the post-Moore era, offering new levels of efficiency, power, performance, and form-factor advantages to the semiconductor industry. However, thermal management in 3D-ICs presents a critical challenge that must be overcome to ensure prosperity for this technology. Unlike traditional thermal management solutions that perceive heat generation in 3D-ICs negatively and aim to eliminate it, th… Show more
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