A study for a typical leakage failure of PCBA with no-cleaning process

He, Xiaodong; Zhou, Liang; Shen, Jianghua

doi:10.1109/icept.2016.7583088

Cited by 6 publications

(1 citation statement)

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“…Therefore both SIR and ECM can be considered as overstress mechanisms, which give a short product lifetime. There is some literature on leak current or ECM investigation without considering the time and relation of them [18][19][20][21] however, in most cases, individual parameters are investigated rather than multi-parameter interactions [22][23][24][25]. Forasmuch as often there is no individual factor to create a failure, finding interactions of parameters and intensity impact of each interaction at least in two-way, and three-way interactions besides, the relation between leak current and time to ECM beginning are imperative for the right understanding of failure process and proper prediction.…”

Section: Introductionmentioning

confidence: 99%

Investigation of critical factors effect to predict leakage current and time to failure due to ECM on PCB under humidity

Bahrebar

Ambat

2021

Microelectronics Reliability

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Experiments using the Design of Experiment (DoE) methodology were carried out to investigate the effects of pitch distance (P), temperature (T), voltage (V), and contamination (C) on the leak current measured on surface insulation resistance (SIR) test boards. A 2 4 full factorial design with eight replications was performed, and the response was measured continuously over a 20 hour period for each experiment. Current measured over time exhibited a clear pattern of an initial low and stable current, followed by a transition to a much higher current. Microscopic analysis of the boards indicates that the transition is due to dendrite formation due to electrochemical migration (ECM). The time at the start of this transition phase was identified as the time to failure (TTF) for each experiment. Leakage current (LC) was also calculated as the mean current prior to failure. Analysis of Variance methods were used to model both TTF and LC. Both TTF and LC were found to be significantly affected by P, T, and C. However, the effect of V was found to be significant only for TTF. The general current behavior over the prolonged experimental period and the resulting statistical models give new insight into the failure process related to ECM.

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