A State-of-the-Art Review on Conducted Electromagnetic Interference in Non-Isolated DC to DC Converters

Natarajan, Sudhakar; Babu, Thanikanti Sudhakar; Balasubramanian, Karthik; Subramaniam, Umashankar; Almakhles, Dhafer

doi:10.1109/access.2019.2961954

Cited by 32 publications

(19 citation statements)

References 123 publications

(115 reference statements)

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“…Different studies show that the void crack formation and expansion in the solder is related to the stress density [25]- [27]. This can be spread out along the solder under vibration and especially when the higher PSD inputs apply to the component, the higher damages can be reported.…”

Section: Combination Of the Rv And Tc Analysis And Resultsmentioning

confidence: 99%

Investigation of the Thermal Loading and Random Vibration Influences on Fatigue Life of the Solder Joints for a Metal-Oxide-Semiconductor-Field-Effect Transistor in a DC-DC Power Boost Converter

Subramaniam

Yang

et al. 2020

IEEE Access

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This study presents the effects of the vibration and thermal cycling on the fatigue life of a power Metal Oxide Semiconductor Field Effect Transistor (MOSFET) in a power converter circuit. The fatigue mechanism in per loading mode was investigated separately and based on the overlap approach, the synchronous effects were analyzed. The solder creeps' attitudes are depended on the fatigue life for the thermal loops. The success of the deposited strain per thermal loop is in direct relation with the fatigue lifetime. The main source of the stress in the packaging process is the differences between the components' thermal coefficients. To evaluate the effects of the vibration on the fatigue life for the solder layers, the RMS value of the peeling stress was considered. According to the results, the maximum stress and main affected points realized at the corners of the layers. It has been identified that the assembling of the thermal effects and mechanical loads are quickened the failure rate at the solder joints for this device. The Finite Element Method (FEM) is used for the simulation and the results confirm the estimated crack formation places in the layers.INDEX TERMS Solder joints, power MOSFET, fatigue life, finite element method (FEM). I. INTRODUCTIONPower electronics applications and designs widely are expanding based on their inevitable role in Renewable Energy Sources (RESs), industries and aerospace implementations to transmit the power to the load side [1], [2]. In recent years, many comprehensive studies are presented for DC-DC power boost converters that are the main structure between the RESs and load sides. These converters are including the power components like diode and switches. For high frequency and efficient circuits normally power MOSFETs are selected [3]-[6].The associate editor coordinating the review of this manuscript and approving it for publication was Francesco Della Corte .

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Section: Combination Of the Rv And Tc Analysis And Resultsmentioning

confidence: 99%

Investigation of the Thermal Loading and Random Vibration Influences on Fatigue Life of the Solder Joints for a Metal-Oxide-Semiconductor-Field-Effect Transistor in a DC-DC Power Boost Converter

Subramaniam

Yang

et al. 2020

IEEE Access

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“…However, the design may need further solutions to meet the legal requirements. EMI suppression methods could be applied: 1) at the noise source (the generation stage) and/or 2) along the transmission path [82], [83]. Solutions related to noise source can be further categorized as:…”

Section: Simulation Methodologiesmentioning

confidence: 99%

Modeling of Conducted Emissions for EMI Analysis of Power Converters: State-of-the-Art Review

2020

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Electromagnetic interference issues are associated with high-speed switching of power converters. EMI modeling is an essential tool to study and control the EMI emission, enabling more efficient solutions. A comprehensive review and comparison of different modeling approaches for conducted emissions are provided in this paper, which can be used as a design guideline for engineers. For a motor drive application, common mode and differential mode conducted emissions are studied, and dominant noise production mechanisms are identified. Moreover, a review of various modeling techniques is presented for the main parasitic components of the system. Finally, time domain and frequency domain analysis approaches are explored along with the equivalent circuits which enable fast prediction of EMI emissions. This paper intends to help the reader develop an organized understanding of conducted emission modeling to assist them with a more efficient and electromagnetically-compatible design. INDEX TERMS Circuit modeling, common mode, conducted emission, differential mode, electromagnetic interference (EMI), motor drive inverters.

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“…Furthermore, in [18], A. Amin and S. Choi also pay their attention to WBG devices and emphasize the role of passive filters and active filters in EMI reduction. In [19], EMI reduction methods for DC-DC converters are discussed, but zero CMV techniques are not included. Collectively, these review papers are somewhat lacking in quantitative analysis and arguably do not comprehensively review the full spectrum of EMI reduction methods for inverter fed drives.…”

Section: Introductionmentioning

confidence: 99%

A Review on Conductive Common-Mode EMI Suppression Methods in Inverter Fed Motor Drives

Zhang

Chen

et al. 2021

IEEE Access

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The impact of electromagnetic interference (EMI) is an increasingly important aspect of the performance of switching inverters. The challenges of managing EMI continue to grow with the emergence of wide bandgap (WBG) devices, the trend towards ever-greater integration and higher power rating. This paper reviews suppression methods for the conductive common-mode (CM) EMI in inverter fed motor drives. In order to span EMI suppression across the full system design process, the review considers both mitigation from the sources and suppression along the conduction paths. Furthermore, the shortcomings and merits of the reviewed publications are discussed, and their attenuation frequency range and attenuation level are compared. It is demonstrated that the CM EMI at low frequency is mainly determined by the PWM strategies and can be reduced or even theoretically eliminated through zero common-mode control. On the other hand, the CM EMI at high frequency is markedly influenced by the switching transients of the power devices. Thus, various drive circuits are reviewed which improve the switching behavior. Finally, the deployment of passive and active filters to suppress or compensate for the EMI is discussed.INDEX TERMS Conductive EMI, EMI sources, inverter fed motor drives, propagation paths.

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A State-of-the-Art Review on Conducted Electromagnetic Interference in Non-Isolated DC to DC Converters

Cited by 32 publications

References 123 publications

Investigation of the Thermal Loading and Random Vibration Influences on Fatigue Life of the Solder Joints for a Metal-Oxide-Semiconductor-Field-Effect Transistor in a DC-DC Power Boost Converter

Investigation of the Thermal Loading and Random Vibration Influences on Fatigue Life of the Solder Joints for a Metal-Oxide-Semiconductor-Field-Effect Transistor in a DC-DC Power Boost Converter

Modeling of Conducted Emissions for EMI Analysis of Power Converters: State-of-the-Art Review

A Review on Conductive Common-Mode EMI Suppression Methods in Inverter Fed Motor Drives

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