A State-of-the-Art Review of Fatigue Life Prediction Models for Solder Joint

Abstract

Fatigue failure of solder joints is one of the major causes of failure in electronic devices. Fatigue life prediction models of solder joints were first put forward in the early 1960s, and since then, numbers of methods were used to model the fatigue mechanism of solder joints. In this article, the majority fatigue life models are summarized, with emphasis on the latest developments in the fatigue life prediction methods. All the models reviewed are grouped into four categories based on the factors affecting the fatigue life of solder joints, which are: plastic strain-based fatigue models, creep damage-based fatigue models, energy-based fatigue models, and damage accumulation-based fatigue models. The models that do not fit any of the above categories are grouped into “other models.” Applications and potential limitations for those models are also discussed.

Comparing and Benchmarking Fatigue Behaviours of Various SAC Solders under Thermo-Mechanical Loading

“…This model takes the temperature and frequency into account making it easier to get a more precise result. The relationship is presented in equation 1 and the value of c is obtained from equation 2 [43].…”

“…When solder joints are at high extreme temperature, creep failure dominates; and when exposed to temperature cycling, fatigue failure dominates [13]- [20], [43]. If under the combination of both, the failure mechanism is generally referred to as creep-fatigue [21], [53].…”

“…∆ = (3) where ∆ is the plastic shear strain range and and are constants. For 60/40 Tin-lead solder material from −50℃ to 150℃, and are estimated to be 0.51 and 1.14 respectively [43], [58].…”

“…Different researchers have studied the effect of ageing on the fatigue, and mechanical properties of solder interconnect. The vital influence of ageing was found on shear strength, drop fatigue performance, thermal cycling reliability, fracture behaviour, microstructure, hardness, creep behaviour, and cyclic shear reliability [19], [31]- [43]. In this study, the Anand viscoplastic constitutive model has been used in the prediction of five solder alloys (lead-based eutectic Sn63Pb37 and lead-free SAC (SAC305, SAC387, SAC396 and SAC405) solders using FEA simulation to determine the damage parameter (plastic strain range).…”

Experimental characterization of rolled annealed copper film used in flexible printed circuit boards: Identification of the elastic-plastic and low-cycle fatigue behaviors

“…For other mechanical loadings, the strain tensor can have a general form and only the accumulated plastic strain increment is meaningful. Note that other relationships have been proposed in the literature [29] and could have been selected. In our paper, the main challenge is to obtain reliable prediction of the accumulated plastic strain increment, and not the selection of one particular law.…”