A SPICE Macromodel for the Analysis of Lossy Dispersive Coupled GaAs Interconnect Line System

Abstract

A SPICE macromodel for the transient analysis of lossy dispersive coupled GaAs interconnect line system is considered. The model is based on finite Fourier integral transform in spatial domain and is used to the study the transient nature of the signals, signal delays, distortions and crosstalk in IC interconnections in digital integrated circuits. An equivalent circuit model is derived from the resulting nonlinear differential equations and is implemented as a macromodel in a general purpose circuit simulator, SPICE. The model provides an easy method of including skin effect and dispersion of the lines. This macromodel is an alternative method to the multiple PI or Tee sections lumped element modeling of distributed systems. The simulation times and accuracy are well compared to the reduced order PI section lumped element models.