2017
DOI: 10.1016/j.measurement.2017.01.056
|View full text |Cite
|
Sign up to set email alerts
|

A simple optical system for miniature spindle runout monitoring

Abstract: We proposed a novel optical technique to monitor miniature spindle runout in a simple manner. Miniature spindles are commonly used in many machining applications, for example: micro-milling and micro-grinding. However, the capacitive sensors (CS) or eddy current sensors typically used for spindle runout measurements cannot be used for miniature spindle systems. This is due to the nonlinearity of the charge between a curved surface and a flat plate (sensing area) and a curved surface (measuring target area) and… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2

Citation Types

0
2
0

Year Published

2019
2019
2023
2023

Publication Types

Select...
6
1

Relationship

0
7

Authors

Journals

citations
Cited by 22 publications
(2 citation statements)
references
References 19 publications
(29 reference statements)
0
2
0
Order By: Relevance
“…While various wafer edge inspection systems have been developed based on bright, dark field, or combined optical microscopy, challenges to reduce system cost while increase inspection resolution still remain 4,5 . Lee introduced curved-edge interferometry for spindle health monitoring and inspired by his work, curved-edge interferometry was adapted to conduct wafer edge metrology and inspection in this study 6,7 . Diffractive fringe patterns on wafer edge were collected, features representing defects modes were further extracted and classified through various statistical analysis methods and wavelet transform.…”
Section: Introductionmentioning
confidence: 99%
“…While various wafer edge inspection systems have been developed based on bright, dark field, or combined optical microscopy, challenges to reduce system cost while increase inspection resolution still remain 4,5 . Lee introduced curved-edge interferometry for spindle health monitoring and inspired by his work, curved-edge interferometry was adapted to conduct wafer edge metrology and inspection in this study 6,7 . Diffractive fringe patterns on wafer edge were collected, features representing defects modes were further extracted and classified through various statistical analysis methods and wavelet transform.…”
Section: Introductionmentioning
confidence: 99%
“…At this stage, the coded mark points have a good application prospect in measurement [7,8]. Zhao Junqiao applied the coded mark points to the automatic parking system to match the related information [9].…”
Section: Introductionmentioning
confidence: 99%