2012
DOI: 10.1088/1674-1056/21/9/097104
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A simple method of extracting the polarization charge density in the AlGaN/GaN heterostructure from current-voltage and capacitance-voltage characteristics

Abstract: An Ni Schottky contact on the AlGaN/GaN heterostructure is fabricated. The flat-band voltage for the Schottky contact on the AlGaN/GaN heterostructure is obtained from the forward current—voltage characteristics. With the measured capacitance—voltage curve and the flat-band voltage, the polarization charge density in the AlGaN/GaN heterostructure is investigated, and a simple formula for calculating the polarization charge density is obtained and analyzed. With the approach described in this paper, the obtaine… Show more

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Cited by 7 publications
(4 citation statements)
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“…Based on the measured C-V curves and the forward I-V characteristics of the gate and source contacts for the prepared AlGaN/AlN/GaN HFETs, the polarization charge densities under the gate contacts (ρ G ) corresponding to different gate voltages can be calculated by self-consistently solving Schrödinger's and Poisson's equations, [10] the results are listed in Table 1 The Schottky barrier height (φ b ) used for this calculation can also be calculated from the measured C-V curves and the forward I-V characteristics of the gate and source contacts by self-consistently solving Schrödinger's and Poisson's equations, [11] the results are also shown in Table 1. The details of the above calculation can be found in Refs.…”
Section: Calculation and Analysesmentioning
confidence: 99%
“…Based on the measured C-V curves and the forward I-V characteristics of the gate and source contacts for the prepared AlGaN/AlN/GaN HFETs, the polarization charge densities under the gate contacts (ρ G ) corresponding to different gate voltages can be calculated by self-consistently solving Schrödinger's and Poisson's equations, [10] the results are listed in Table 1 The Schottky barrier height (φ b ) used for this calculation can also be calculated from the measured C-V curves and the forward I-V characteristics of the gate and source contacts by self-consistently solving Schrödinger's and Poisson's equations, [11] the results are also shown in Table 1. The details of the above calculation can be found in Refs.…”
Section: Calculation and Analysesmentioning
confidence: 99%
“…[1] Low frequency noise (LFN) in HEMT is important since it becomes an important limitation of the device performances. These mechanisms originate either from trapping-detrapping processes in surface states and deep traps associated with material quality induced by piezoelectric polarization effects [2,3] or from permanent degradation induced by hot carrier interaction with trap sites occurring in the gatedrain region. [4] Although in as early as 1998, Balandin et al [5] measured the GaN-based HEMTs 1/ f noise.…”
Section: Introductionmentioning
confidence: 99%
“…[14] Compared with a GaAs material system, a GaN material system has a larger LO phonon energy (∼ 90 meV). Its alloys with aluminum nitride and related quantum wells have attracted significant attention in recent years, resulting in many successful advances [15][16][17] based on this material system. Previous attempts to grow nonpolar GaN by vapor phase and molecular beam epitaxy yielded rough and faceted surfaces that were unsuitable for use in practical devices.…”
Section: Introductionmentioning
confidence: 99%