2000
DOI: 10.1109/55.841299
|View full text |Cite
|
Sign up to set email alerts
|

A simple and reliable wafer-level electrical probing technique for III-nitride light-emitting epitaxial structures

Abstract: We report an easy-to-implement wafer-level electroluminescence characterization technique for InGaN/GaN light-emitting diodes (LED's) epi-wafers by means of multiple electrical probes. By first damaging the p-n junctions of the LED epilayer at localized spots, diode-like current versus voltage characteristics and emission spectra can be obtained at injection currents as high as 100 mA. This allows a relative but reliable comparison of device-related parameters such as differential quantum efficiency, leakage c… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1
1

Citation Types

0
6
0

Year Published

2003
2003
2015
2015

Publication Types

Select...
5

Relationship

0
5

Authors

Journals

citations
Cited by 7 publications
(6 citation statements)
references
References 7 publications
0
6
0
Order By: Relevance
“…Figure 6 shows the EL images of 1 cm × 1 cm large-area LEDs fabricated with AgNW TCEs (at 50 mA). The devices were simply fabricated using a quick-test structure 74 and indium as both the n - and p -contacts. The LEDs showed bright light emission across the entire active region, suggesting that the large-area LEDs could be fabricated using efficient AgNW spreading contact.…”
Section: Discussionmentioning
confidence: 99%
“…Figure 6 shows the EL images of 1 cm × 1 cm large-area LEDs fabricated with AgNW TCEs (at 50 mA). The devices were simply fabricated using a quick-test structure 74 and indium as both the n - and p -contacts. The LEDs showed bright light emission across the entire active region, suggesting that the large-area LEDs could be fabricated using efficient AgNW spreading contact.…”
Section: Discussionmentioning
confidence: 99%
“…9 The contact probe apparatus is shown schematically in Fig. 9 The contact probe apparatus is shown schematically in Fig.…”
Section: W So and H Liumentioning
confidence: 99%
“…9 The contact probe apparatus is shown schematically in Fig. 9 Using this arrangement, I -V data were collected from multiple devices on the same wafers with an HP 4145 semiconductor parameter analyzer. It consists of three spring-loaded probes with about 1 mm spacing between each.…”
Section: W So and H Liumentioning
confidence: 99%
“…The electrical behavior of the contact is evaluated using a wafer-level probing technique that does not require full fabrication of the LED [12]. In this method, localized damage is first made by applying a high voltage (70-80 V) between two sharp probes (2 and 3).…”
Section: Resultsmentioning
confidence: 99%