A Simple and Direct Method for Local Temperature Measurement and its Applications to Materials Evaluations

Recently, the size of solder bump interconnects have been significantly reduced with the advent of highdensity packaging, and thus the evaluation of electromigration in solder bumps has become necessary. The present paper proposes a simple method to test the electromigration resistance of Pb-free solders. One of the key points of the present method is the fabrication of a simple solder sample that can produce sufficient current density to cause electromigration. Moreover, the actual local temperature of a small area subjected to electromigration in the sample was measured by a direct method. A right-angled diamondshaped hole was introduced in a thin film of solder using a focused-ion-beam system. A direct current was supplied to the film far from the hole, perpendicular to the diagonal of the hole. In this way, the current density was concentrated near to the corner of the hole, and the value of this was obtained through a theoretical analysis. It was noted that the steady temperature in the film along a line extending from the diagonal, remained constant, although the current density decreased gradually far from the corner. Therefore, the temperature at a position near the corner, where electromigration takes place, can easily be found by measuring the temperature far from the corner. The temperature was measured directly under current flow conditions by utilizing the chemical reagents with known melting points. Finally, by measuring the ratio of hillock volume to the time for the current supply as a measure of the atomic flux divergence due to electromigration, the corresponding resistances of some Pb-free solders to electromigration were evaluated.

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A simple method for testing the electromigration resistance of solders

Saka

Kohara

Hasegawa

et al. 2008

Microsyst Technol

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A technique utilizing chemical reagents for direct measurement of temperature at a local area and its engineering applications

Saka

Hasegawa

2009

Acta Mech Sin

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Temperature is one of the physical quantities through which quantitative evaluation of the safety and reliability of industrial products can be achieved, and this has been used widely in practice. Under any environmental condition, regardless of the size of the object to be inspected, accurate and reliable measurement of temperature is of great practical importance. This review article presents a simple and direct method of temperature measurement, that can be applied to the local areas with difficulty in measuring the temperature by using normal thermometers. In the present article, two different application examples are demonstrated. One addresses the study of the electromigration of solders which are used as bonding metals in electronic devices (micro-structures). The application of the method to the shaft of a motor used in heavy industrial fields is explained as the second.

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A new technique to measure the temperature of a rotating motor shaft

Hasegawa

Kawashima

2009

Applied Thermal Engineering

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A Simple and Direct Method for Local Temperature Measurement and its Applications to Materials Evaluations

Cited by 3 publications

References 2 publications

A simple method for testing the electromigration resistance of solders

A simple method for testing the electromigration resistance of solders

A technique utilizing chemical reagents for direct measurement of temperature at a local area and its engineering applications

A new technique to measure the temperature of a rotating motor shaft

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