A silicon rubber composite with enhanced thermal conductivity and mechanical properties based on nanodiamond and boron nitride fillers

Abstract

Silicone rubber (SR) is a nonreactive and stable material that is widely applied in a wide variety of products including electrical and electronic appliances.Currently, the synthesis of SR with enhanced thermal conductivity and mechanical properties is of great significance. Herein, an improved thermal conductive SR composite was synthesized by using nanodiamond (ND) and boron nitride (BN) as composite thermal conductivity fillers to the terminal hydroxyl functional group of SR. We studied the thermal conductivity and mechanical properties of the composites as well as the effects of different ratios of BN and ND fillers on the properties of SR composite. The results show that the thermal conductivity of the SR composite filled with 6 phr ND and 70 phr BN was up to 0.82 W/m K, which was remarkably increased by 70.83% than that of modified by a single filler (i.e., 70 phr BN). Moreover, the SR composite prepared with dual fillers (BN-ND) showed better thermal stability, and the maximum thermal degradation temperature that was higher than that of the composite prepared with a single filler and pure SR. Furthermore, the mechanical properties of the sample indicators were found to be better than those of the currently available similar products on the market.

A study of the mechanical performance of nanocomposites of polyethylene containing exfoliated boron nitride nanoplatelets

“…In order to understand the relationship of mechanical properties of nanocomposites with the molecular architecture and interactions between the polymeric chains chain, we have endeavored to further analyze the actual enhancement mechanism responsible for the improvement in the mechanical properties of the nanocomposites. As suggested by previous researchers, [ 30–34 ] the improved mechanical properties of polymer‐BNNP nanocomposites primarily resulted from a stronger interfacial bonding interaction between fillers and polymer matrix, brought about by the treatment with surfactants. However our work, the enhancement of mechanical properties of nanocomposites can be mainly attributed to the formation of partially stretched HDPE chains during the twin‐screw extrusion process and the “sunflower‐like” core‐shell structure of HDPE‐BNNP nanocomposites.…”

Thermally conductive polymer-based composites: fundamentals, progress and flame retardancy/anti-electromagnetic interference design

“…It has been observed that the combination of various thermally conductive fillers makes it easier to form an efficient thermally conductive network synergistically in the matrix owing to the synergistic effect of different thermally conductive fillers, eventually improving the thermal conductivity of polymer-based composites 50,101,102,109–121 (Table 5). The thermal conductivity of the epoxy resin composite was enhanced at a thermally conductive filler loading of 42 wt% (the ratio of AlN and BN = 2 : 1), the thermal conductivity of which was 0.57 W m −1 K −1 .…”

Anchoring modified polystyrene to boron nitride nanosheets as highly thermal conductive composites for heat dissipation

“…As a result, the heat accumulation and heat flux in electrical equipment both rise. [ 1–4 ] To ensure cruising time and operational durability of electronic equipment, it is putting forward severer requirements to dissipate heat. [ 5,6 ]…”

“…As a result, the heat accumulation and heat flux in electrical equipment both rise. [1][2][3][4] To ensure cruising time and operational durability of electronic equipment, it is putting forward severer requirements to dissipate heat. [5,6] Thermal conductive composites are one of the most promising types of polymer-based composites for thermal management in current electrical applications that demand high thermal conductivity (TC), remarkable thermal stability, and superior electrical insulation.…”