2016
DOI: 10.1039/c5py01669j
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A side-chain engineering approach to solvent-resistant semiconducting polymer thin films

Abstract: Latent H-bonds in conjugated statistical copolymers rendered semiconducting thin films resistant to solvent immersion.

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Cited by 35 publications
(43 citation statements)
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“…We first performed thermogravimetric analysis (TGA) of BocPIQA to demonstrate a weight loss at 160 C-200 C ( Figure 3B), representing the Boc cleavage process. 59 This phenomenon was similar to that of BocIQA ( Figure S21), and the 22% weight loss agreed well with the theoretical weight percentage of Boc groups in BocPIQA (23%). Furthermore, FT-IR was used to characterize the chemical structure before and after the thermal cleavage.…”
Section: Synthesis and Characterizationsupporting
confidence: 84%
See 1 more Smart Citation
“…We first performed thermogravimetric analysis (TGA) of BocPIQA to demonstrate a weight loss at 160 C-200 C ( Figure 3B), representing the Boc cleavage process. 59 This phenomenon was similar to that of BocIQA ( Figure S21), and the 22% weight loss agreed well with the theoretical weight percentage of Boc groups in BocPIQA (23%). Furthermore, FT-IR was used to characterize the chemical structure before and after the thermal cleavage.…”
Section: Synthesis and Characterizationsupporting
confidence: 84%
“…This problem can be solved by a reversible hydrogen-bond protection strategy. [55][56][57][58][59] The N-H groups in the PIQA backbone can be reversibly protected by bulky tert-butyloxycarbonyl (Boc) groups. As a result, much higher solubility of the Boc-functionalized ladder polymer (BocPIQA, Figure 1B) was expected for characterization and solution processing.…”
Section: Molecular Designmentioning
confidence: 99%
“…[17][18][19][20] The advantage of such design lies in the complete removal of the insulating functionalizing chains from the active layer, often resulting in improvements of charge transport properties. [16,17,[21][22][23][24][25][26] Very recently, such an approach was extended to naphthalene diimide (NDI) containing polymers, one of the most promising classes of n-type polymeric semiconductors. [27,28] In this strategy, the imide nitrogen was functionalized -either directly or through an alkyl spacer -with a cleavable ester functionality.…”
Section: Introductionmentioning
confidence: 99%
“…A different method to stabilize polymer films makes use of cleavable moieties that solubilize the polymer until removed. The cleavable chains can be designed to cleave by several external stimuli, such as heat, UV‐light, acid, or base . Many of these make use of large side chains, which means that the cleaved off groups stay in the film.…”
Section: Introductionmentioning
confidence: 99%